JPS5731189A - Substrate for mounting electronic parts - Google Patents
Substrate for mounting electronic partsInfo
- Publication number
- JPS5731189A JPS5731189A JP10642680A JP10642680A JPS5731189A JP S5731189 A JPS5731189 A JP S5731189A JP 10642680 A JP10642680 A JP 10642680A JP 10642680 A JP10642680 A JP 10642680A JP S5731189 A JPS5731189 A JP S5731189A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic parts
- mounting electronic
- mounting
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10642680A JPS5731189A (en) | 1980-08-04 | 1980-08-04 | Substrate for mounting electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10642680A JPS5731189A (en) | 1980-08-04 | 1980-08-04 | Substrate for mounting electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5731189A true JPS5731189A (en) | 1982-02-19 |
Family
ID=14433324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10642680A Pending JPS5731189A (en) | 1980-08-04 | 1980-08-04 | Substrate for mounting electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5731189A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019036710A (en) * | 2017-08-14 | 2019-03-07 | 三星電子株式会社Samsung Electronics Co.,Ltd. | Circuit board and semiconductor package using the same |
-
1980
- 1980-08-04 JP JP10642680A patent/JPS5731189A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019036710A (en) * | 2017-08-14 | 2019-03-07 | 三星電子株式会社Samsung Electronics Co.,Ltd. | Circuit board and semiconductor package using the same |
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