JPS5724555A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5724555A JPS5724555A JP10006280A JP10006280A JPS5724555A JP S5724555 A JPS5724555 A JP S5724555A JP 10006280 A JP10006280 A JP 10006280A JP 10006280 A JP10006280 A JP 10006280A JP S5724555 A JPS5724555 A JP S5724555A
- Authority
- JP
- Japan
- Prior art keywords
- supporting
- lead
- ground
- semiconductor
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
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- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L2224/732—Location after the connecting process
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- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
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- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To facilitate the connection of connecting fine wire through preventing solving-out of Au-Si alloy by cutting grooves across the supporting and ground leads of the semiconductor securing part. CONSTITUTION:Concave grooves 207 are provided in the lead 202 and ground lead 203 supporting the semiconductor element securing part 201. Due to these grooves, the solving-out of Au-Si alloy 205 toward supporting lead and ground lead can be prevented and the connection of fine wire 206 interconnecting the semiconductor 204 and supporting and ground leads is facilitated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10006280A JPS5724555A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10006280A JPS5724555A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5724555A true JPS5724555A (en) | 1982-02-09 |
Family
ID=14263975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10006280A Pending JPS5724555A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5724555A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594647U (en) * | 1982-07-01 | 1984-01-12 | 日本電気株式会社 | Lead frame for semiconductor devices |
JPS5910249A (en) * | 1982-07-09 | 1984-01-19 | Nec Corp | Lead frame for semiconductor device |
JPS6174137A (en) * | 1984-09-19 | 1986-04-16 | Hitachi Maxell Ltd | Magnetic disk |
JPS61127634U (en) * | 1985-01-29 | 1986-08-11 | ||
JPH04196574A (en) * | 1990-11-28 | 1992-07-16 | Mitsubishi Electric Corp | Lead frame |
JP2008066553A (en) * | 2006-09-08 | 2008-03-21 | Furukawa Electric Co Ltd:The | Semiconductor device |
JP2011249475A (en) * | 2010-05-25 | 2011-12-08 | Denso Corp | Power semiconductor device |
-
1980
- 1980-07-22 JP JP10006280A patent/JPS5724555A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594647U (en) * | 1982-07-01 | 1984-01-12 | 日本電気株式会社 | Lead frame for semiconductor devices |
JPS5910249A (en) * | 1982-07-09 | 1984-01-19 | Nec Corp | Lead frame for semiconductor device |
JPS6347351B2 (en) * | 1982-07-09 | 1988-09-21 | Nippon Electric Co | |
JPS6174137A (en) * | 1984-09-19 | 1986-04-16 | Hitachi Maxell Ltd | Magnetic disk |
JPS61127634U (en) * | 1985-01-29 | 1986-08-11 | ||
JPH04196574A (en) * | 1990-11-28 | 1992-07-16 | Mitsubishi Electric Corp | Lead frame |
JP2008066553A (en) * | 2006-09-08 | 2008-03-21 | Furukawa Electric Co Ltd:The | Semiconductor device |
JP2011249475A (en) * | 2010-05-25 | 2011-12-08 | Denso Corp | Power semiconductor device |
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