JPS57211258A - Cooling device for semiconductor device - Google Patents

Cooling device for semiconductor device

Info

Publication number
JPS57211258A
JPS57211258A JP9598081A JP9598081A JPS57211258A JP S57211258 A JPS57211258 A JP S57211258A JP 9598081 A JP9598081 A JP 9598081A JP 9598081 A JP9598081 A JP 9598081A JP S57211258 A JPS57211258 A JP S57211258A
Authority
JP
Japan
Prior art keywords
bag
rubber
plates
circumference
rest
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9598081A
Other languages
Japanese (ja)
Inventor
Isao Nishimura
Kazuo Hirota
Ichiro Ishi
Yutaka Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9598081A priority Critical patent/JPS57211258A/en
Publication of JPS57211258A publication Critical patent/JPS57211258A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain sufficient cooling effect without giving concentrated stress by a method wherein the bottom face of the bag type container with sealed liquid type refrigerant is partially formed by the material which can be formed into a rigid body, and the rigid part is contacted to the back side of chips. CONSTITUTION:Small plates 7a, which were hardened by mixing Al powder with Si rubber, are arranged on a rest D, the clearance between the plates is buried by pouring Si rubber into it, the plates are peeled off the rest D after hardening, they are pressed to the prescribed thickness, and a film 5b is formed. Si rubber film 5a is superposed on the above, and the bag type container 5 is formed by adhering the circumference, and a copper pipe 8 is arranged in such a manner that it makes a zigzag line in the bag. The circumference of the bag 5 is pinched between Al frames 11 and 12, tightened by a bolt 13 and the bag 5 is covered from above a substrate 1. When a proper quantity of pure water 6 is poured 10 into the bag and the bag is maintained in a freely transformable state, the bag 5 hangs down due to the weight of the pure water, the rigid body 7 comes in contact with the corresponding chips 2 lightly and uniformly under the prescribed pressure without allowing the generation of transformation and the concentrated stress. Also, since the thermal resistance can be maintained at a sufficiently low level, a satisfactory cooling effect can be obtained without characteristic deterioration and breakdown on the semiconductor device.
JP9598081A 1981-06-23 1981-06-23 Cooling device for semiconductor device Pending JPS57211258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9598081A JPS57211258A (en) 1981-06-23 1981-06-23 Cooling device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9598081A JPS57211258A (en) 1981-06-23 1981-06-23 Cooling device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57211258A true JPS57211258A (en) 1982-12-25

Family

ID=14152301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9598081A Pending JPS57211258A (en) 1981-06-23 1981-06-23 Cooling device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57211258A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037757A (en) * 1983-08-10 1985-02-27 Mitsubishi Electric Corp Semiconductor device
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US6504720B2 (en) 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
CN105828538A (en) * 2016-05-19 2016-08-03 张惠莹 Resistor and conductor welding device
CN105934096A (en) * 2016-05-19 2016-09-07 张惠莹 Welding apparatus for lead wire and copper pipe
CN106216892A (en) * 2016-05-19 2016-12-14 张惠莹 Circuit board resistance and the automatic welding device of copper pipe

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPS6037757A (en) * 1983-08-10 1985-02-27 Mitsubishi Electric Corp Semiconductor device
US6504720B2 (en) 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
CN106216893A (en) * 2016-05-19 2016-12-14 张惠莹 Circuit board resistance and the automatic welding machine of copper pipe
CN105934096A (en) * 2016-05-19 2016-09-07 张惠莹 Welding apparatus for lead wire and copper pipe
CN106216892A (en) * 2016-05-19 2016-12-14 张惠莹 Circuit board resistance and the automatic welding device of copper pipe
CN105828538A (en) * 2016-05-19 2016-08-03 张惠莹 Resistor and conductor welding device
CN106271240A (en) * 2016-05-19 2017-01-04 张惠莹 Circuit board resistance and the automatic soldering device of copper pipe
CN106271240B (en) * 2016-05-19 2018-05-25 佛山市顺德区凯祥电器有限公司 The automatic soldering device of circuit board resistance and copper pipe
CN106216893B (en) * 2016-05-19 2018-06-05 中山市兴杰电器有限公司 The automatic welding machine of circuit board resistance and copper pipe
CN106216892B (en) * 2016-05-19 2018-08-03 日照东泰铜业合金有限公司 The automatic welding device of circuit board resistance and copper pipe
CN105828538B (en) * 2016-05-19 2019-01-04 李成城 The welder of resistance and conducting wire
CN105934096B (en) * 2016-05-19 2019-01-04 李成城 The welder of conducting wire and copper pipe

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