JPS543469A - Resin sealing method for semiconductor device - Google Patents

Resin sealing method for semiconductor device

Info

Publication number
JPS543469A
JPS543469A JP6843377A JP6843377A JPS543469A JP S543469 A JPS543469 A JP S543469A JP 6843377 A JP6843377 A JP 6843377A JP 6843377 A JP6843377 A JP 6843377A JP S543469 A JPS543469 A JP S543469A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin sealing
sealing method
frame
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6843377A
Other languages
Japanese (ja)
Other versions
JPS5643609B2 (en
Inventor
Yoshitaka Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP6843377A priority Critical patent/JPS543469A/en
Publication of JPS543469A publication Critical patent/JPS543469A/en
Publication of JPS5643609B2 publication Critical patent/JPS5643609B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To form a square frame component using the heat-resistant and insulating material to fill the heat hardening solid resin into the frame while securing a margin area at the lower part to store the semiconductor element and then to put the frame onto the substrate to which the element is adhered with a heating process given. Thus, the productivity can be increased for the semiconductor device.
COPYRIGHT: (C)1979,JPO&Japio
JP6843377A 1977-06-09 1977-06-09 Resin sealing method for semiconductor device Granted JPS543469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6843377A JPS543469A (en) 1977-06-09 1977-06-09 Resin sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6843377A JPS543469A (en) 1977-06-09 1977-06-09 Resin sealing method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS543469A true JPS543469A (en) 1979-01-11
JPS5643609B2 JPS5643609B2 (en) 1981-10-14

Family

ID=13373555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6843377A Granted JPS543469A (en) 1977-06-09 1977-06-09 Resin sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS543469A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144827A (en) * 1990-07-12 1992-09-08 Sumitomo Heavy Industries, Ltd Rolling mill stand

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144827A (en) * 1990-07-12 1992-09-08 Sumitomo Heavy Industries, Ltd Rolling mill stand

Also Published As

Publication number Publication date
JPS5643609B2 (en) 1981-10-14

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