JPS57195120A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57195120A
JPS57195120A JP7940381A JP7940381A JPS57195120A JP S57195120 A JPS57195120 A JP S57195120A JP 7940381 A JP7940381 A JP 7940381A JP 7940381 A JP7940381 A JP 7940381A JP S57195120 A JPS57195120 A JP S57195120A
Authority
JP
Japan
Prior art keywords
epoxy resin
halogen
resin composition
component
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7940381A
Other languages
Japanese (ja)
Other versions
JPS6336330B2 (en
Inventor
Tadahiro Nakada
Tadashi Ashida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP7940381A priority Critical patent/JPS57195120A/en
Publication of JPS57195120A publication Critical patent/JPS57195120A/en
Publication of JPS6336330B2 publication Critical patent/JPS6336330B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare the titled composition having excellent storage stability, curing characteristics and physical properties, by using a curing agent obtained by the condensation of bisphenol S, formaldehyde and a phenolic compound.
CONSTITUTION: The objective composition is obtained by compounding (A) an epoxy resin having ≥2 epoxy groups in a molecule with (B) a curing agent of formula (Y1WY4 are 0W1, provided that at least one of y1Wy4 is 1; R is alkyl, alkoxy or halogen; x is 0W2; x is halogen; m is 0W4), and if necessary, adding proper solvents, fillers), etc. to the mixture. The amount of the epoxy group in the component (A) is adjusted to nearly equimolar to the phenolic OH group in the component (B).
COPYRIGHT: (C)1982,JPO&Japio
JP7940381A 1981-05-27 1981-05-27 Epoxy resin composition Granted JPS57195120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7940381A JPS57195120A (en) 1981-05-27 1981-05-27 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7940381A JPS57195120A (en) 1981-05-27 1981-05-27 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57195120A true JPS57195120A (en) 1982-11-30
JPS6336330B2 JPS6336330B2 (en) 1988-07-20

Family

ID=13688885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7940381A Granted JPS57195120A (en) 1981-05-27 1981-05-27 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57195120A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235145A (en) * 1985-04-12 1986-10-20 鐘淵化学工業株式会社 Metallic-foil lined laminated board and manufacture thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522488Y2 (en) * 1988-04-07 1993-06-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235145A (en) * 1985-04-12 1986-10-20 鐘淵化学工業株式会社 Metallic-foil lined laminated board and manufacture thereof
JPH0582293B2 (en) * 1985-04-12 1993-11-18 Kanegafuchi Chemical Ind

Also Published As

Publication number Publication date
JPS6336330B2 (en) 1988-07-20

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