JPS57192019A - Continuous heat treatment device - Google Patents
Continuous heat treatment deviceInfo
- Publication number
- JPS57192019A JPS57192019A JP7653981A JP7653981A JPS57192019A JP S57192019 A JPS57192019 A JP S57192019A JP 7653981 A JP7653981 A JP 7653981A JP 7653981 A JP7653981 A JP 7653981A JP S57192019 A JPS57192019 A JP S57192019A
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- wafers
- shafts
- heat treatment
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
PURPOSE:To subject uniform heat treatment to a material to be treated by continuously passing the material in a reaction tube by a transfer mechanism using a slot loosely fitting the material. CONSTITUTION:A heater 3 covered with a cover 2 consisting of a heat insulating material is arranged onto the outer circumferential section of the cylindrical reaction tube 1, both ends thereof are opened. Three shafts 7 for carrying are mounted into the reaction tube 1 in the longitudinal direction, and feed screws 8 are formed to the outer circumferences of the shafts 7. The fringe sections of semiconductor wafers 10 are loosely fitted into the slots 9 of the feed screws 8, the shafts 7 are turned by a driving source 11, and the wafers 10 are transferred to an outlet section 6 from the inlet section 5 of the reaction tube 1 at every one sheet. Accordingly, since the wafers 10 pass through a treating chamber 4 in the reaction tube 1 at every one sheet, the wafers are treated continuously while being thermally treated uniformly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7653981A JPS57192019A (en) | 1981-05-22 | 1981-05-22 | Continuous heat treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7653981A JPS57192019A (en) | 1981-05-22 | 1981-05-22 | Continuous heat treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57192019A true JPS57192019A (en) | 1982-11-26 |
Family
ID=13608067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7653981A Pending JPS57192019A (en) | 1981-05-22 | 1981-05-22 | Continuous heat treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57192019A (en) |
-
1981
- 1981-05-22 JP JP7653981A patent/JPS57192019A/en active Pending
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