JPS5719128A - Preparation of mold for continuous casting - Google Patents
Preparation of mold for continuous castingInfo
- Publication number
- JPS5719128A JPS5719128A JP9608280A JP9608280A JPS5719128A JP S5719128 A JPS5719128 A JP S5719128A JP 9608280 A JP9608280 A JP 9608280A JP 9608280 A JP9608280 A JP 9608280A JP S5719128 A JPS5719128 A JP S5719128A
- Authority
- JP
- Japan
- Prior art keywords
- internal wall
- wall surface
- plating layer
- taper surface
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Continuous Casting (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To increase the adhesive strength of plating metal and to facilitate the preparation of a mold by forming a taper surface facing the upper half part of a mold body by shaving the inside of the lower half part and by providing a metal plating layer after activation. CONSTITUTION:The inside of the lower half of a mold body 1 is shaved to form a lower-half internal wall surface 3B and a taper surface 3C outside an upper-half internal wall surface 3A, and they are smoothed, degreased and washed. After the upper-half internal wall surface 3A is covered with a tape 7, the lower-half internal wall surface 3B and the taper surface 3C are activated with a mixed solution of sulfuric acid and hydrogen peroxide. The activated surface is plated with nickel or nickel alloy. As the taper surface 3C has been formed between the upper and lower- half internal wall surfaces 3A and 3B, the adhesive strength of the plating layer 5 to the taper surface 3C is improved. Then, the tape coating 7 is removed and the excessive swelling of the plating layer 5 is shaved. The work is finished by making the internal wall surface 3A flush with the intenal peripheral surface 6 of the plating layer 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9608280A JPS5719128A (en) | 1980-07-10 | 1980-07-10 | Preparation of mold for continuous casting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9608280A JPS5719128A (en) | 1980-07-10 | 1980-07-10 | Preparation of mold for continuous casting |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5719128A true JPS5719128A (en) | 1982-02-01 |
JPH0144425B2 JPH0144425B2 (en) | 1989-09-27 |
Family
ID=14155466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9608280A Granted JPS5719128A (en) | 1980-07-10 | 1980-07-10 | Preparation of mold for continuous casting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5719128A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60184528A (en) * | 1984-02-29 | 1985-09-20 | Nitto Electric Ind Co Ltd | Surface treatment of fluorocarbon resin molding |
JPS63185091A (en) * | 1987-01-28 | 1988-07-30 | 三井金属鉱業株式会社 | Circuit board and manufacture of the same |
JPH04234437A (en) * | 1990-10-04 | 1992-08-24 | Internatl Business Mach Corp <Ibm> | Manufacture of metal/organic polymer composite |
CN105063704A (en) * | 2015-07-31 | 2015-11-18 | 广东欧珀移动通信有限公司 | Die-casting aluminum alloy electroplating pretreatment process and electronic device |
CN106903281A (en) * | 2017-02-21 | 2017-06-30 | 河南蓝火激光科技有限公司 | A kind of wear-resistant gradient of resistance to heat etching coating crystallizer copper plate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929053A (en) * | 1972-07-12 | 1974-03-15 |
-
1980
- 1980-07-10 JP JP9608280A patent/JPS5719128A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929053A (en) * | 1972-07-12 | 1974-03-15 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60184528A (en) * | 1984-02-29 | 1985-09-20 | Nitto Electric Ind Co Ltd | Surface treatment of fluorocarbon resin molding |
JPH032378B2 (en) * | 1984-02-29 | 1991-01-14 | Nitto Denko Corp | |
JPS63185091A (en) * | 1987-01-28 | 1988-07-30 | 三井金属鉱業株式会社 | Circuit board and manufacture of the same |
JPH04234437A (en) * | 1990-10-04 | 1992-08-24 | Internatl Business Mach Corp <Ibm> | Manufacture of metal/organic polymer composite |
CN105063704A (en) * | 2015-07-31 | 2015-11-18 | 广东欧珀移动通信有限公司 | Die-casting aluminum alloy electroplating pretreatment process and electronic device |
CN106903281A (en) * | 2017-02-21 | 2017-06-30 | 河南蓝火激光科技有限公司 | A kind of wear-resistant gradient of resistance to heat etching coating crystallizer copper plate |
Also Published As
Publication number | Publication date |
---|---|
JPH0144425B2 (en) | 1989-09-27 |
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