JPS57190339A - Manufacture of printed circuit board unit - Google Patents

Manufacture of printed circuit board unit

Info

Publication number
JPS57190339A
JPS57190339A JP7418381A JP7418381A JPS57190339A JP S57190339 A JPS57190339 A JP S57190339A JP 7418381 A JP7418381 A JP 7418381A JP 7418381 A JP7418381 A JP 7418381A JP S57190339 A JPS57190339 A JP S57190339A
Authority
JP
Japan
Prior art keywords
lead
frames
electrodes
printed circuit
leaves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7418381A
Other languages
Japanese (ja)
Inventor
Satoshi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp, Pioneer Electronic Corp filed Critical Pioneer Corp
Priority to JP7418381A priority Critical patent/JPS57190339A/en
Publication of JPS57190339A publication Critical patent/JPS57190339A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain many circuit borad units all together by a method wherein lead frames are connected to electrodes of a plurality of drawn up printed circuit boards at the sametime and then common frames are removed. CONSTITUTION:Printed circuit boards 10a on which electronic parts are mounted are drawn up with a certain interval and with electrodes 10e facing outside. On the other hand, lead frames 20 are composed of common frames 20b and lead leaves 20a which are provided to the common frames 20b corresponding to the circuit borads 10a and the electrodes 10e. The circut borads 10a are held between tips of the lead leaves 20a and the lead leaves 20a get contact with the electrodes 10e and the lead leaves 20a are soldered all together. Then connected parts are sealed 10d with resin by molds. After that the common frames 20b are removed and the lead leaves 20a are bent at right angles to the surfaces of the circuit borads 10a. With this constitution, cost can be significantly reduced by excellent productivity.
JP7418381A 1981-05-19 1981-05-19 Manufacture of printed circuit board unit Pending JPS57190339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7418381A JPS57190339A (en) 1981-05-19 1981-05-19 Manufacture of printed circuit board unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7418381A JPS57190339A (en) 1981-05-19 1981-05-19 Manufacture of printed circuit board unit

Publications (1)

Publication Number Publication Date
JPS57190339A true JPS57190339A (en) 1982-11-22

Family

ID=13539795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7418381A Pending JPS57190339A (en) 1981-05-19 1981-05-19 Manufacture of printed circuit board unit

Country Status (1)

Country Link
JP (1) JPS57190339A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182946U (en) * 1983-05-24 1984-12-06 松下電器産業株式会社 Hybrid integrated circuit device
FR2650714A1 (en) * 1989-08-04 1991-02-08 Broadcast Television Syst METHOD FOR BRAKING ELECTRICAL COMPONENTS WITH A PRINTED CIRCUIT BOARD AND BRAZING FRAME FOR IMPLEMENTING THE METHOD
US5067229A (en) * 1989-03-07 1991-11-26 Rohm Co., Ltd. Cutting device for use in manufacturing electronic components
FR2731869A1 (en) * 1995-03-17 1996-09-20 Fujitsu Ltd CIRCUIT BOARD AND METHOD FOR MANUFACTURING THIS CIRCUIT BOARD
US5619794A (en) * 1994-03-17 1997-04-15 Teijin Seiki Co., Ltd. Complex structure molding process and apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518034A (en) * 1978-07-25 1980-02-07 Sony Corp Method of fabricating hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518034A (en) * 1978-07-25 1980-02-07 Sony Corp Method of fabricating hybrid integrated circuit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182946U (en) * 1983-05-24 1984-12-06 松下電器産業株式会社 Hybrid integrated circuit device
US5067229A (en) * 1989-03-07 1991-11-26 Rohm Co., Ltd. Cutting device for use in manufacturing electronic components
FR2650714A1 (en) * 1989-08-04 1991-02-08 Broadcast Television Syst METHOD FOR BRAKING ELECTRICAL COMPONENTS WITH A PRINTED CIRCUIT BOARD AND BRAZING FRAME FOR IMPLEMENTING THE METHOD
US5619794A (en) * 1994-03-17 1997-04-15 Teijin Seiki Co., Ltd. Complex structure molding process and apparatus
FR2731869A1 (en) * 1995-03-17 1996-09-20 Fujitsu Ltd CIRCUIT BOARD AND METHOD FOR MANUFACTURING THIS CIRCUIT BOARD
US5940964A (en) * 1995-03-17 1999-08-24 Fujitsu Limited Fabrication process for circuit substrate having interconnection leads

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