JPS57188858A - Plastic molded type semiconductor device - Google Patents
Plastic molded type semiconductor deviceInfo
- Publication number
- JPS57188858A JPS57188858A JP56075444A JP7544481A JPS57188858A JP S57188858 A JPS57188858 A JP S57188858A JP 56075444 A JP56075444 A JP 56075444A JP 7544481 A JP7544481 A JP 7544481A JP S57188858 A JPS57188858 A JP S57188858A
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- thin strips
- resin molded
- plastic molded
- taking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 238000009413 insulation Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56075444A JPS57188858A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
US06/378,435 US4503452A (en) | 1981-05-18 | 1982-05-14 | Plastic encapsulated semiconductor device and method for manufacturing the same |
CA000403080A CA1180469A (en) | 1981-05-18 | 1982-05-17 | Plastic encapsulated semiconductor device and method for manufacturing the same |
DE8282104364T DE3267996D1 (en) | 1981-05-18 | 1982-05-18 | Plastic encapsulated semiconductor device and method for manufacturing the same |
EP82104364A EP0066188B1 (en) | 1981-05-18 | 1982-05-18 | Plastic encapsulated semiconductor device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56075444A JPS57188858A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57188858A true JPS57188858A (en) | 1982-11-19 |
JPS6227750B2 JPS6227750B2 (ja) | 1987-06-16 |
Family
ID=13576421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56075444A Granted JPS57188858A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US4503452A (ja) |
EP (1) | EP0066188B1 (ja) |
JP (1) | JPS57188858A (ja) |
CA (1) | CA1180469A (ja) |
DE (1) | DE3267996D1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128645A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS60229352A (ja) * | 1984-04-26 | 1985-11-14 | Fuji Electric Co Ltd | 樹脂封止形半導体装置および樹脂封止方法 |
JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59130449A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | 絶縁型半導体素子用リードフレーム |
JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
DE3535605C1 (de) * | 1985-10-05 | 1986-12-04 | Telefunken electronic GmbH, 7100 Heilbronn | Halbleiteranordnung |
EP0257681A3 (en) * | 1986-08-27 | 1990-02-07 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
US4884125A (en) * | 1986-10-15 | 1989-11-28 | Sanyo Electic Co., Ltd. | Hybrid integrated circuit device capable of being inserted into socket |
MX171416B (es) * | 1988-02-20 | 1993-10-26 | Itt Ind Gmbh Deutsche | Dispositivo semiconductor, metodo para fabricar el mismo, aparato para llevar a cabo el metodo, e instalacion de ensamblado |
EP0336173A3 (en) * | 1988-04-05 | 1990-04-25 | Siemens Aktiengesellschaft | Molded component package isolating interior substrate by recesses containing exposed breakoffs |
US5011256A (en) * | 1988-10-28 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Package for an opto-electronic component |
US5521427A (en) * | 1992-12-18 | 1996-05-28 | Lsi Logic Corporation | Printed wiring board mounted semiconductor device having leadframe with alignment feature |
US5886400A (en) * | 1995-08-31 | 1999-03-23 | Motorola, Inc. | Semiconductor device having an insulating layer and method for making |
US5977630A (en) * | 1997-08-15 | 1999-11-02 | International Rectifier Corp. | Plural semiconductor die housed in common package with split heat sink |
US6255722B1 (en) * | 1998-06-11 | 2001-07-03 | International Rectifier Corp. | High current capacity semiconductor device housing |
JP2010073841A (ja) * | 2008-09-18 | 2010-04-02 | Sony Corp | 光学パッケージ素子、表示装置、および電子機器 |
DE102013220880B4 (de) * | 2013-10-15 | 2016-08-18 | Infineon Technologies Ag | Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend |
DE102015118245A1 (de) * | 2015-10-26 | 2017-04-27 | Infineon Technologies Austria Ag | Thermisches Schnittstellenmaterial mit definierten thermischen, mechanischen und elektrischen Eigenschaften |
JP1646470S (ja) * | 2019-05-14 | 2019-11-25 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51137376A (en) * | 1975-05-22 | 1976-11-27 | Mitsubishi Electric Corp | Manufacturing method for plastic seal type semi conductor |
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS54159177A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Resin sealed semiconductor device |
JPS5563854A (en) * | 1978-11-08 | 1980-05-14 | Nec Kyushu Ltd | Method of manufacturing semiconductor device |
JPS5587468A (en) * | 1978-12-25 | 1980-07-02 | Nec Corp | Lead frame |
JPS5596663A (en) * | 1979-01-16 | 1980-07-23 | Nec Corp | Method of fabricating semiconductor device |
JPS55108755A (en) * | 1979-02-14 | 1980-08-21 | Nec Corp | Resin seal type semiconductor device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716764A (en) * | 1963-12-16 | 1973-02-13 | Texas Instruments Inc | Process for encapsulating electronic components in plastic |
NL6903229A (ja) * | 1969-03-01 | 1970-09-03 | ||
US3611250A (en) * | 1969-09-10 | 1971-10-05 | Amp Inc | Integrated circuit module and assembly |
US3793709A (en) * | 1972-04-24 | 1974-02-26 | Texas Instruments Inc | Process for making a plastic-encapsulated semiconductor device |
IT993429B (it) * | 1973-09-26 | 1975-09-30 | Sgs Ates Componenti | Perfezionamento di una cassa per dispositivo a semiconduttori |
JPS54111766A (en) * | 1978-02-22 | 1979-09-01 | Hitachi Ltd | Coupling construction of lead and heat sink in semiconductor device |
US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
JPS5619646A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Resin sealing type semiconductor device |
JPS5662344A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Resin sealed semiconductor device |
-
1981
- 1981-05-18 JP JP56075444A patent/JPS57188858A/ja active Granted
-
1982
- 1982-05-14 US US06/378,435 patent/US4503452A/en not_active Expired - Lifetime
- 1982-05-17 CA CA000403080A patent/CA1180469A/en not_active Expired
- 1982-05-18 EP EP82104364A patent/EP0066188B1/en not_active Expired
- 1982-05-18 DE DE8282104364T patent/DE3267996D1/de not_active Expired
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51137376A (en) * | 1975-05-22 | 1976-11-27 | Mitsubishi Electric Corp | Manufacturing method for plastic seal type semi conductor |
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS54159177A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Resin sealed semiconductor device |
JPS5563854A (en) * | 1978-11-08 | 1980-05-14 | Nec Kyushu Ltd | Method of manufacturing semiconductor device |
JPS5587468A (en) * | 1978-12-25 | 1980-07-02 | Nec Corp | Lead frame |
JPS5596663A (en) * | 1979-01-16 | 1980-07-23 | Nec Corp | Method of fabricating semiconductor device |
JPS55108755A (en) * | 1979-02-14 | 1980-08-21 | Nec Corp | Resin seal type semiconductor device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128645A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPH0527261B2 (ja) * | 1983-12-16 | 1993-04-20 | Hitachi Ltd | |
JPH0530070B2 (ja) * | 1983-12-16 | 1993-05-07 | Hitachi Ltd | |
JPS60229352A (ja) * | 1984-04-26 | 1985-11-14 | Fuji Electric Co Ltd | 樹脂封止形半導体装置および樹脂封止方法 |
JPH0318741B2 (ja) * | 1984-04-26 | 1991-03-13 | Fuji Electric Co Ltd | |
JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
EP0066188B1 (en) | 1985-12-18 |
US4503452A (en) | 1985-03-05 |
EP0066188A1 (en) | 1982-12-08 |
CA1180469A (en) | 1985-01-02 |
DE3267996D1 (en) | 1986-01-30 |
JPS6227750B2 (ja) | 1987-06-16 |
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