JPS57188836A - Recognizing method for position - Google Patents

Recognizing method for position

Info

Publication number
JPS57188836A
JPS57188836A JP56073528A JP7352881A JPS57188836A JP S57188836 A JPS57188836 A JP S57188836A JP 56073528 A JP56073528 A JP 56073528A JP 7352881 A JP7352881 A JP 7352881A JP S57188836 A JPS57188836 A JP S57188836A
Authority
JP
Japan
Prior art keywords
measuring point
pellet
recognized
measuring
allowable range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56073528A
Other languages
Japanese (ja)
Other versions
JPH0133940B2 (en
Inventor
Nobuhiro Takasugi
Ryuichi Kyomasu
Seiji Shigyo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56073528A priority Critical patent/JPS57188836A/en
Publication of JPS57188836A publication Critical patent/JPS57188836A/en
Publication of JPH0133940B2 publication Critical patent/JPH0133940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To recognize the position of a body, a position thereof is to be recognized, such as a pellet positively by using one side of measuring points as reference and deciding the presence of the other measuring point within the allowable range of the one measuring point. CONSTITUTION:The measuring points 2a, 3a are photographed by means of a camera 4, said measuring points are recognized by an arithmetical operating section 10, and the presence of the other measuring point 2a within necessary ranges in the X direction and Y direction is decided using one measuring point 3a as reference in a defective recognizing checking section 14. When the other measuring point 2a exists within the allowable range, confirming signals are outputted to a control section 11, a wire bonder 12 is operated and bonding is conducted while the pellet is removed from the object of wire bonding when the other measuring point 2a does not exist within the allowable range, and the position of the pellet is recognized through the second check of defective recognition.
JP56073528A 1981-05-18 1981-05-18 Recognizing method for position Granted JPS57188836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56073528A JPS57188836A (en) 1981-05-18 1981-05-18 Recognizing method for position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56073528A JPS57188836A (en) 1981-05-18 1981-05-18 Recognizing method for position

Publications (2)

Publication Number Publication Date
JPS57188836A true JPS57188836A (en) 1982-11-19
JPH0133940B2 JPH0133940B2 (en) 1989-07-17

Family

ID=13520820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56073528A Granted JPS57188836A (en) 1981-05-18 1981-05-18 Recognizing method for position

Country Status (1)

Country Link
JP (1) JPS57188836A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60229176A (en) * 1984-04-26 1985-11-14 Toshiba Seiki Kk Pattern recognition device
JP2010276581A (en) * 2009-06-01 2010-12-09 Honda Motor Co Ltd Sensing erroneous determination prevention method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60229176A (en) * 1984-04-26 1985-11-14 Toshiba Seiki Kk Pattern recognition device
JP2010276581A (en) * 2009-06-01 2010-12-09 Honda Motor Co Ltd Sensing erroneous determination prevention method

Also Published As

Publication number Publication date
JPH0133940B2 (en) 1989-07-17

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