JPS57113237A - Recognition device - Google Patents
Recognition deviceInfo
- Publication number
- JPS57113237A JPS57113237A JP55189542A JP18954280A JPS57113237A JP S57113237 A JPS57113237 A JP S57113237A JP 55189542 A JP55189542 A JP 55189542A JP 18954280 A JP18954280 A JP 18954280A JP S57113237 A JPS57113237 A JP S57113237A
- Authority
- JP
- Japan
- Prior art keywords
- data
- binary signal
- circuit
- signal
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
- Image Analysis (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
Abstract
PURPOSE:To detect an insufficient image as improper wiring by converting a reference wiring pattern video signal into binary signal, storing the enlarged image as a reference data in a memory, and comparing the read data with the data of input image. CONSTITUTION:An image pickup device 6 picks up a semiconductor chip 5 on an X-Y stage 1 in an automatic wire bonder. A pretreating circuit 7 converts a video signal from the device 6 into a binary signal and increases the thickness of the line. A memory 10 stores the enlarged image data of the reference wiring pattern converted to binary signal and increased in the thickness of the line from the circuit 7. A pattern data comparator 8 compares the input image data relative to the recognition pattern with the enlarged image data, and the comparison signal is outputted to an output device 12. A control circuit 11 controls the entire system. In this manner, improper warning cycle can be extremely shortened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55189542A JPS57113237A (en) | 1980-12-30 | 1980-12-30 | Recognition device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55189542A JPS57113237A (en) | 1980-12-30 | 1980-12-30 | Recognition device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57113237A true JPS57113237A (en) | 1982-07-14 |
Family
ID=16243047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55189542A Pending JPS57113237A (en) | 1980-12-30 | 1980-12-30 | Recognition device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57113237A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5935892A (en) * | 1982-08-20 | 1984-02-27 | Nec Corp | Laser working device |
JPS59121563A (en) * | 1982-12-28 | 1984-07-13 | Fujitsu Ltd | Device for correcting design data of integrated circuit |
JPS59123983A (en) * | 1982-12-29 | 1984-07-17 | Fujitsu Ltd | Pattern checking device |
JPS59220883A (en) * | 1983-05-30 | 1984-12-12 | Hitachi Ltd | Repeated pattern checking device |
-
1980
- 1980-12-30 JP JP55189542A patent/JPS57113237A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5935892A (en) * | 1982-08-20 | 1984-02-27 | Nec Corp | Laser working device |
JPS59121563A (en) * | 1982-12-28 | 1984-07-13 | Fujitsu Ltd | Device for correcting design data of integrated circuit |
JPS59123983A (en) * | 1982-12-29 | 1984-07-17 | Fujitsu Ltd | Pattern checking device |
JPS59220883A (en) * | 1983-05-30 | 1984-12-12 | Hitachi Ltd | Repeated pattern checking device |
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