JPS57186358A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57186358A
JPS57186358A JP7042681A JP7042681A JPS57186358A JP S57186358 A JPS57186358 A JP S57186358A JP 7042681 A JP7042681 A JP 7042681A JP 7042681 A JP7042681 A JP 7042681A JP S57186358 A JPS57186358 A JP S57186358A
Authority
JP
Japan
Prior art keywords
layer
poly
wiring
substrate
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7042681A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP7042681A priority Critical patent/JPS57186358A/en
Publication of JPS57186358A publication Critical patent/JPS57186358A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain an IC, the degree of integration thereof is high and which functions at high speed, by forming an electrode wiring layer in the multilayer constitution of poly Si and Al and doping the impurity of the same conduction type as the diffusion layer of a substrate to the connecting section of the diffusion layer of a substrate to the connecting section of the diffusion layer and poly Si. CONSTITUTION:An opening is forned to a SiO2 film 12 on an N type Si substrate 11 and a P layer 13 is shaped, and the wiring layers of poly Si 14 and Al 15 are formed. The P type impurity is diffused from the whole surface of diffused to poly Si from the P layer 13 in the opening section in the poly Si 14, and both the poly Si 14 and the P layer 13 are kept in the same conduction type. According to this constitution, even when the opening of the film 12 protrudes from the layer 13, the layer 13 can small be shaped because the direct alloying and short circuit of the upper Al wiring 15 with the Si substrate 11 can be avoided by the presence of the P type poly Si layer. Contact resistance does not increase in the contact of wiring and the layer 13 because both the wiring and the layer 13 are made of Si, both may be connected in minute size, and the IC, the degree of integration thereof is high and which functions at high speed, is obtained.
JP7042681A 1981-05-11 1981-05-11 Semiconductor device Pending JPS57186358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7042681A JPS57186358A (en) 1981-05-11 1981-05-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7042681A JPS57186358A (en) 1981-05-11 1981-05-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57186358A true JPS57186358A (en) 1982-11-16

Family

ID=13431134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7042681A Pending JPS57186358A (en) 1981-05-11 1981-05-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57186358A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115979A (en) * 1974-07-31 1976-02-07 Hitachi Ltd HANDOTAISOCHINODENKYOKUKEISEIHO
JPS55125646A (en) * 1979-03-20 1980-09-27 Toshiba Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115979A (en) * 1974-07-31 1976-02-07 Hitachi Ltd HANDOTAISOCHINODENKYOKUKEISEIHO
JPS55125646A (en) * 1979-03-20 1980-09-27 Toshiba Corp Semiconductor device

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