JPS57176729A - Forming method for pattern - Google Patents
Forming method for patternInfo
- Publication number
- JPS57176729A JPS57176729A JP6290481A JP6290481A JPS57176729A JP S57176729 A JPS57176729 A JP S57176729A JP 6290481 A JP6290481 A JP 6290481A JP 6290481 A JP6290481 A JP 6290481A JP S57176729 A JPS57176729 A JP S57176729A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- film
- layer
- wet etching
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 4
- 238000001039 wet etching Methods 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 230000001788 irregular Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
PURPOSE:To obtain a pattern having no irregular wet etching by selectively removing an insulating film of upper layer of the insulating layer laminated on a semiconductor substrate and covering the all surface of the substrate with a hydrophilic and water soluble organic substance. CONSTITUTION:A resist film pattern 4 is formed on the first layer insulating film 2 and second layer insulating films 3 laminated on a semiconductor substrate 1, the film 3 is selectively removed using the pattern 4 as a mask, and a thin film layer 5 made a of hydrophilic and water soluble organic substance is formed on the overall surface of the substrate 1, thereby forming a desired pattern by wet etching at the film 2. In this manner, the etchant is immersed upto the surface of the film 2 even in fine pattern, thereby performing wet etching without irregularity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6290481A JPS57176729A (en) | 1981-04-23 | 1981-04-23 | Forming method for pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6290481A JPS57176729A (en) | 1981-04-23 | 1981-04-23 | Forming method for pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57176729A true JPS57176729A (en) | 1982-10-30 |
Family
ID=13213700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6290481A Pending JPS57176729A (en) | 1981-04-23 | 1981-04-23 | Forming method for pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57176729A (en) |
-
1981
- 1981-04-23 JP JP6290481A patent/JPS57176729A/en active Pending
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