JPS57167623A - Semicondutor device and manufacture thereof - Google Patents
Semicondutor device and manufacture thereofInfo
- Publication number
- JPS57167623A JPS57167623A JP5397681A JP5397681A JPS57167623A JP S57167623 A JPS57167623 A JP S57167623A JP 5397681 A JP5397681 A JP 5397681A JP 5397681 A JP5397681 A JP 5397681A JP S57167623 A JPS57167623 A JP S57167623A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- silicon layer
- polycrystal
- substrate
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
PURPOSE:To obtain an itegrated circuit of high performance and low cost by forming an insulation film, a polycrystal silicon layer and a single crystal silicon layer piled one after another on a silicon semiconductor substrate. CONSTITUTION:An insulating silicon oxide film 2 is formed on the main surface of a silicon substrate 1 by thermal oxidization method. Then a polycrystal silicon layer 3 is formed on the sinsulating silicon oxide film 2 by chemical vapor phase growth method. Then, using silicon vapor phase epitaxial growth technique, the substrate is put in the hydrogen atmosphere in a reaction vessel which is heated to high temperature, for instance 950 deg.C-1,200 deg.C, and silicon source material such as SiH4 or SiH2C/2 is introduced and a single crystal silicon layer 4 is formed on the polycrystal silicon layer 3 by the heat distribution of such silicon source gas and by hydrogen reduction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5397681A JPS57167623A (en) | 1981-04-08 | 1981-04-08 | Semicondutor device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5397681A JPS57167623A (en) | 1981-04-08 | 1981-04-08 | Semicondutor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57167623A true JPS57167623A (en) | 1982-10-15 |
Family
ID=12957668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5397681A Pending JPS57167623A (en) | 1981-04-08 | 1981-04-08 | Semicondutor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57167623A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5234668A (en) * | 1975-09-11 | 1977-03-16 | Kokusai Electric Co Ltd | Gaseous phase growing process of semiconductor |
-
1981
- 1981-04-08 JP JP5397681A patent/JPS57167623A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5234668A (en) * | 1975-09-11 | 1977-03-16 | Kokusai Electric Co Ltd | Gaseous phase growing process of semiconductor |
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