JPS57153448A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS57153448A JPS57153448A JP3848381A JP3848381A JPS57153448A JP S57153448 A JPS57153448 A JP S57153448A JP 3848381 A JP3848381 A JP 3848381A JP 3848381 A JP3848381 A JP 3848381A JP S57153448 A JPS57153448 A JP S57153448A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- windows
- alloy
- poly
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To improve the reliability and yield of a device by forming a Si film under Al wiring or connecting one part of the wiring of a Si-Al alloy to an element and shaping a window to an insulating film at the outside of the wiring on the surface of a Si substrate when the substrate to which the element is formed is coated, the window is shaped to the insulating film and Al is wired. CONSTITUTION:A P base and an N omitter are formed to a region 4 obtained by isolating an N epitaxial layer on the P type Si substrate by a P layer 3, the surface is coated with the insulating film 7 and the windows are molded. When poly Si and Al are laminated and the electrode wiring 9B, 9E, 9C are manufactured, projections are formed onto the wiring even when using the Al-Si alloy, and disconnection and wiring width are reduced. On the other hand, a projection is not formed when the wiring only of Al and in the exposed section of single crystal Si. The windows 11 are shaped at the outside of an element forming region along both sides of the wiring 9E by utilizing the phenomenon, and the windows are covered with poly Si and Al. When such structure, the projection is not molded to Al for wiring, and the yield and reliability of the IC are improved. Even when the windows 11 are exposed, effect is not affected. Even when the Si-Al alloy is used in place of the poly Si in order to prevent the spike of the alloy, the structure is effective.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848381A JPS57153448A (en) | 1981-03-17 | 1981-03-17 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848381A JPS57153448A (en) | 1981-03-17 | 1981-03-17 | Semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57153448A true JPS57153448A (en) | 1982-09-22 |
Family
ID=12526498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3848381A Pending JPS57153448A (en) | 1981-03-17 | 1981-03-17 | Semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153448A (en) |
-
1981
- 1981-03-17 JP JP3848381A patent/JPS57153448A/en active Pending
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