JPS57145361A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS57145361A
JPS57145361A JP56030310A JP3031081A JPS57145361A JP S57145361 A JPS57145361 A JP S57145361A JP 56030310 A JP56030310 A JP 56030310A JP 3031081 A JP3031081 A JP 3031081A JP S57145361 A JPS57145361 A JP S57145361A
Authority
JP
Japan
Prior art keywords
film
type
layer
region
type region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56030310A
Other languages
Japanese (ja)
Inventor
Shigemi Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56030310A priority Critical patent/JPS57145361A/en
Publication of JPS57145361A publication Critical patent/JPS57145361A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain C-MOSIC having high integration and no bi-polar effect by preparing N-channel and P-channel transistors in such a manner that they are overlaped each other vertically. CONSTITUTION:A thick field oxide film 102 is formed at the peripheral part of an N type Si substrate 101, a thin gate oxide film 103 is connected to an active region surrounded by the film 102, and a gate electrode 104 of polycrystalline Si containing N type impurities is provided in the central part of the film 103 so as to surround an oxide film 105. Next, by using this film as a mask, a P type region 106 is formed diffusely in active regions on both sides of the film 105, a polycrystalline Si layer containing P type impurities is grown on the whole surface and subjected to laser annealing and thereby a P type single crystal layer 107 is formed. Afterward, an N type region 108 is formed diffusely in the layer 107 located on both sides of the gate electrode 104, the layer 107 in an inactive region which is an unnecessary part is removed by the photoetching method, an inter-layer insulator film 109 is grown on the whole surface by the CVD method, an opening 110 is provided, Al wiring electrodes 111 are connected to the P type region 106 and N type region 108 respectively, and thus a device having a three- dimensional structure is prepared.
JP56030310A 1981-03-03 1981-03-03 Semiconductor integrated circuit device Pending JPS57145361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56030310A JPS57145361A (en) 1981-03-03 1981-03-03 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56030310A JPS57145361A (en) 1981-03-03 1981-03-03 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS57145361A true JPS57145361A (en) 1982-09-08

Family

ID=12300199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56030310A Pending JPS57145361A (en) 1981-03-03 1981-03-03 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57145361A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192081A (en) * 1981-05-19 1982-11-26 Ibm Field effect transistor unit
JPS59103380A (en) * 1982-11-09 1984-06-14 ノーザン・テレコム・リミテッド Laminated mos transistor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN=1973US *
IEEE ELECTRON DEVICE LETTERS=1980 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192081A (en) * 1981-05-19 1982-11-26 Ibm Field effect transistor unit
JPH0325949B2 (en) * 1981-05-19 1991-04-09 Intaanashonaru Bijinesu Mashiinzu Corp
JPS59103380A (en) * 1982-11-09 1984-06-14 ノーザン・テレコム・リミテッド Laminated mos transistor
JPH0530075B2 (en) * 1982-11-09 1993-05-07 Northern Telecom Ltd

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