JPS5712775U - - Google Patents
Info
- Publication number
- JPS5712775U JPS5712775U JP8804280U JP8804280U JPS5712775U JP S5712775 U JPS5712775 U JP S5712775U JP 8804280 U JP8804280 U JP 8804280U JP 8804280 U JP8804280 U JP 8804280U JP S5712775 U JPS5712775 U JP S5712775U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8804280U JPS5712775U (ja) | 1980-06-25 | 1980-06-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8804280U JPS5712775U (ja) | 1980-06-25 | 1980-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5712775U true JPS5712775U (ja) | 1982-01-22 |
Family
ID=29450131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8804280U Pending JPS5712775U (ja) | 1980-06-25 | 1980-06-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5712775U (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5830194A (ja) * | 1981-08-14 | 1983-02-22 | 日本碍子株式会社 | セラミック多層配線基板の製造法 |
JPS62115575U (ja) * | 1986-01-13 | 1987-07-22 | ||
JPS62172869U (ja) * | 1986-04-22 | 1987-11-02 | ||
JPH0233975U (ja) * | 1988-08-26 | 1990-03-05 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51133766A (en) * | 1975-05-14 | 1976-11-19 | Ngk Spark Plug Co | Method of forming thick film circuit components on ceramic substrate |
-
1980
- 1980-06-25 JP JP8804280U patent/JPS5712775U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51133766A (en) * | 1975-05-14 | 1976-11-19 | Ngk Spark Plug Co | Method of forming thick film circuit components on ceramic substrate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5830194A (ja) * | 1981-08-14 | 1983-02-22 | 日本碍子株式会社 | セラミック多層配線基板の製造法 |
JPS62115575U (ja) * | 1986-01-13 | 1987-07-22 | ||
JPS62172869U (ja) * | 1986-04-22 | 1987-11-02 | ||
JPH0233975U (ja) * | 1988-08-26 | 1990-03-05 |