JPS57122552A - Cooler for semiconductor element - Google Patents
Cooler for semiconductor elementInfo
- Publication number
- JPS57122552A JPS57122552A JP55178323A JP17832380A JPS57122552A JP S57122552 A JPS57122552 A JP S57122552A JP 55178323 A JP55178323 A JP 55178323A JP 17832380 A JP17832380 A JP 17832380A JP S57122552 A JPS57122552 A JP S57122552A
- Authority
- JP
- Japan
- Prior art keywords
- pieces
- thyristors
- cooling
- cooling pieces
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To enable the reduction in the number of cooling pieces for a semiconductor element used for a cooler by alternately disposing and connecting a converter made of flat elements connected in anti-parallel to each other for flowing currents at an interval shorter than a second via the pieces. CONSTITUTION:In a circuit device which reversibly operating, for example, a DC motor 73, forward and reverse thyristors are alternately mounted via common cooling pieces so that the thyristors are connected to each other. For example, forward thyristors 11-13 and reverse thyristors 21-23 are sequentially alternately interposed among the cooling pieces 81-87, and the pieces 82-86 are used commonly for two respective elements. These pieces and elements are integrated via insulators 93, 94 by a spring 95 and clamping fittings 91, 92, and the conductors 96-99 for forming the circuit are connected to the pieces. In this manner, the number of the cooling pieces can be reduced approximately to a half as compared with a method of interposing the respective thyristors with two cooling pieces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55178323A JPS57122552A (en) | 1980-12-16 | 1980-12-16 | Cooler for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55178323A JPS57122552A (en) | 1980-12-16 | 1980-12-16 | Cooler for semiconductor element |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50102153A Division JPS5226172A (en) | 1975-08-25 | 1975-08-25 | Coolers for semi-conductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57122552A true JPS57122552A (en) | 1982-07-30 |
Family
ID=16046469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55178323A Pending JPS57122552A (en) | 1980-12-16 | 1980-12-16 | Cooler for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57122552A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4946682A (en) * | 1972-07-14 | 1974-05-04 |
-
1980
- 1980-12-16 JP JP55178323A patent/JPS57122552A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4946682A (en) * | 1972-07-14 | 1974-05-04 |
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