GB1226864A - - Google Patents

Info

Publication number
GB1226864A
GB1226864A GB1226864DA GB1226864A GB 1226864 A GB1226864 A GB 1226864A GB 1226864D A GB1226864D A GB 1226864DA GB 1226864 A GB1226864 A GB 1226864A
Authority
GB
United Kingdom
Prior art keywords
bars
bus
rectifiers
rectifier
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1226864A publication Critical patent/GB1226864A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

1,226,864. Semi-conductor devices. SIEMENS A.G. 2 April, 1968 [3 April, 1967], No. 15835/68. Heading H1K. Two semi-conductor rectifiers are located in seats 11, 21 on respective first and second busbars 1, 2 while the free electrodes of each rectifier are connected by conductors 31 to a common terminal 52 supported by electrically insulating spacers 41, 42 between the bus-bars. Each rectifier may be individually housed as shown, and pressed into an aperture in the corresponding bus-bar, surrounded by the locating walls 11, 21 respectively. Soldering may also be used to attach the rectifiers to the bus-bars. In the embodiment shown three pairs of diode rectifiers are situated between a single pair of bus-bars 1, 2, but each pair of bus-bars may be associated with a single pair of devices, the bars being shaped so as to facilitate assembly of several such pairs of bars together.
GB1226864D 1967-04-03 1968-04-02 Expired GB1226864A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0109156 1967-04-03

Publications (1)

Publication Number Publication Date
GB1226864A true GB1226864A (en) 1971-03-31

Family

ID=7529322

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1226864D Expired GB1226864A (en) 1967-04-03 1968-04-02

Country Status (3)

Country Link
DE (1) DE1614478A1 (en)
FR (1) FR1588451A (en)
GB (1) GB1226864A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113711704A (en) * 2019-03-13 2021-11-26 法雷奥电机设备公司 Electronic system and electrical assembly

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2446541A1 (en) * 1979-01-12 1980-08-08 Sev Alternateurs Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin
FR2453500A1 (en) * 1979-04-04 1980-10-31 Sev Alternateurs Semiconductor rectifier for motor vehicle alternator - has diodes soldered to sockets on support plate, with extended contact cross=section
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113711704A (en) * 2019-03-13 2021-11-26 法雷奥电机设备公司 Electronic system and electrical assembly
CN113711704B (en) * 2019-03-13 2023-06-23 法雷奥电机设备公司 Electronic system and electrical assembly
US11955870B2 (en) 2019-03-13 2024-04-09 Valeo Equipements Electriques Moteur Electronic system and electrical assembly

Also Published As

Publication number Publication date
DE1614478A1 (en) 1970-07-16
FR1588451A (en) 1970-04-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees