JPS57114652A - Tin plating method - Google Patents
Tin plating methodInfo
- Publication number
- JPS57114652A JPS57114652A JP56000319A JP31981A JPS57114652A JP S57114652 A JPS57114652 A JP S57114652A JP 56000319 A JP56000319 A JP 56000319A JP 31981 A JP31981 A JP 31981A JP S57114652 A JPS57114652 A JP S57114652A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- powder
- soln
- plating
- contg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 8
- 238000007747 plating Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 1
- 229910001432 tin ion Inorganic materials 0.000 abstract 4
- 239000000843 powder Substances 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000000706 filtrate Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Abstract
PURPOSE:To carry out tin plating of approximately uniform thickness and make the reutilization of the soln. after the plating treatment possible by subjecting an object to be plated consisting of an alloy consisting essentially of a metal nobler than tin to a heat treatment in the presence of an aq. soln. contg. tin powder and tin ions. CONSTITUTION:In the case of using, for example, powder, as an object to be plated consisting of an alloy consisting essentially of a metal nobler in standard electrode potential than tin, tin powder is mixed with the powder to be plated. An aq. soln. contg. tin ions is added to this mixture and the mixture is heated under stirring. The product of the plating completed of reaction is filtered, and is removed of liquid components, after which it is washed and the tin plating powder is recovered. On the other hand, the filtrate is the aq. soln. contg. tin ions alone as metallic ion and therefore it is circulated as it is to the plating proces and is reutilized. In case when the object to be plated is a plate, the plate is immersed in an aq. soln. contg. tin ions suspended with tin powder and is heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56000319A JPS5935433B2 (en) | 1981-01-07 | 1981-01-07 | Tin plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56000319A JPS5935433B2 (en) | 1981-01-07 | 1981-01-07 | Tin plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57114652A true JPS57114652A (en) | 1982-07-16 |
| JPS5935433B2 JPS5935433B2 (en) | 1984-08-28 |
Family
ID=11470582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56000319A Expired JPS5935433B2 (en) | 1981-01-07 | 1981-01-07 | Tin plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5935433B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6665514B2 (en) * | 2015-01-28 | 2020-03-13 | 三菱マテリアル株式会社 | Method for producing silver-coated particles |
| WO2016121558A1 (en) * | 2015-01-28 | 2016-08-04 | 三菱マテリアル株式会社 | Silver-coated particles and method for producing same |
-
1981
- 1981-01-07 JP JP56000319A patent/JPS5935433B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5935433B2 (en) | 1984-08-28 |
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