JPS5710953A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5710953A
JPS5710953A JP8700180A JP8700180A JPS5710953A JP S5710953 A JPS5710953 A JP S5710953A JP 8700180 A JP8700180 A JP 8700180A JP 8700180 A JP8700180 A JP 8700180A JP S5710953 A JPS5710953 A JP S5710953A
Authority
JP
Japan
Prior art keywords
fluid
porous layer
contact
pressure
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8700180A
Other languages
Japanese (ja)
Other versions
JPS6250983B2 (en
Inventor
Masao Fujii
Yoshiyuki Morihiro
Yasuhiro Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8700180A priority Critical patent/JPS5710953A/en
Publication of JPS5710953A publication Critical patent/JPS5710953A/en
Publication of JPS6250983B2 publication Critical patent/JPS6250983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To obtain a pressure-contact electrode excellent in the cooling effect, by a method wherein the heat trasnferring area is increased by forming a porous layer on the surface of a heat sink which is to contact with a fluid. CONSTITUTION:A porous layer 8 is formed on the inner surface of each of grooves 6 in a heat sink 2 to pressure-contact with a semiconductor substrate. There are a large number of hollows 9 in said porous layer 8, and they are filled with a fluid 10. Steam in each hollow 9 becomes a bubble nucleus, and the points where bubbles have been generated are supplied with a fresh fluid, so that the heat transfer rate increases. It is also possible to use a pressurizing plate 7a provided with passages 6 for the fluid 10 as a pressurizing plate 7.
JP8700180A 1980-06-23 1980-06-23 Semiconductor device Granted JPS5710953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8700180A JPS5710953A (en) 1980-06-23 1980-06-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8700180A JPS5710953A (en) 1980-06-23 1980-06-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5710953A true JPS5710953A (en) 1982-01-20
JPS6250983B2 JPS6250983B2 (en) 1987-10-28

Family

ID=13902636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8700180A Granted JPS5710953A (en) 1980-06-23 1980-06-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5710953A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221591U (en) * 1985-07-23 1987-02-09

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0518156Y2 (en) * 1987-07-08 1993-05-14

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265341A (en) * 1975-11-27 1977-05-30 Mitsubishi Electric Corp Heat radiation body
JPS5373654A (en) * 1976-12-13 1978-06-30 Toshiba Corp Heat radiating panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265341A (en) * 1975-11-27 1977-05-30 Mitsubishi Electric Corp Heat radiation body
JPS5373654A (en) * 1976-12-13 1978-06-30 Toshiba Corp Heat radiating panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221591U (en) * 1985-07-23 1987-02-09
JPH0334951Y2 (en) * 1985-07-23 1991-07-24

Also Published As

Publication number Publication date
JPS6250983B2 (en) 1987-10-28

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