JPS5796557A - Cooling supporting base for semiconductor substrate - Google Patents
Cooling supporting base for semiconductor substrateInfo
- Publication number
- JPS5796557A JPS5796557A JP17208580A JP17208580A JPS5796557A JP S5796557 A JPS5796557 A JP S5796557A JP 17208580 A JP17208580 A JP 17208580A JP 17208580 A JP17208580 A JP 17208580A JP S5796557 A JPS5796557 A JP S5796557A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- jacket
- heat
- semiconductor substrate
- baffle plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To improve the efficiency of cooling by lengthening a flowing distance of a cooling medium. CONSTITUTION:In the cooling supporting base, an upper surface of a jacket 11 thereof, where the cooling medium, flows and cools functions as a semiconductor substrate base surface 11c and which executes working with the generation of heat to the semiconductor substrate 3, baffle plates 13a, 13b... are mounted into a passage of the cooling medium. Cooling water enters the jacket 11 from an inner pipe 12a of a double pipe 12, and is jetted radially. The cooling water meanders between a ceiling surface and the bottom by means of the baffle plates 13a, 13b..., and reaches an outer circumference while exchanging heat. Water collected to an outer pipe 12b of the double pipe 12 is cooled by means of a heat exchanger 15 owing to a pump 14, sent into the jacket 11 again through the inner pipe 12a, and the circulation is repeated. Accordingly, heat is excellently exchanged because a chance contacting with the ceiling plate of the jacket is increased and heat conduction by the baffle plates is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17208580A JPS5796557A (en) | 1980-12-08 | 1980-12-08 | Cooling supporting base for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17208580A JPS5796557A (en) | 1980-12-08 | 1980-12-08 | Cooling supporting base for semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5796557A true JPS5796557A (en) | 1982-06-15 |
Family
ID=15935257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17208580A Pending JPS5796557A (en) | 1980-12-08 | 1980-12-08 | Cooling supporting base for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5796557A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0447819A2 (en) * | 1990-03-19 | 1991-09-25 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
| US5177667A (en) * | 1991-10-25 | 1993-01-05 | International Business Machines Corporation | Thermal conduction module with integral impingement cooling |
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
| US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
| JPH0730027A (en) * | 1993-07-12 | 1995-01-31 | Dainippon Screen Mfg Co Ltd | Cooling device of board |
| WO2012154490A1 (en) * | 2011-05-11 | 2012-11-15 | Memc Singapore Pte, Ltd. | Directional solidification furnace heat exchanger |
| TWI405944B (en) * | 2010-12-30 | 2013-08-21 | Kinik Co | Heat dissipation device |
| TWI566675B (en) * | 2013-08-12 | 2017-01-11 | 宏碁股份有限公司 | Cycling heat dissipation module |
-
1980
- 1980-12-08 JP JP17208580A patent/JPS5796557A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0447819A2 (en) * | 1990-03-19 | 1991-09-25 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
| US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
| US5177667A (en) * | 1991-10-25 | 1993-01-05 | International Business Machines Corporation | Thermal conduction module with integral impingement cooling |
| JPH0730027A (en) * | 1993-07-12 | 1995-01-31 | Dainippon Screen Mfg Co Ltd | Cooling device of board |
| TWI405944B (en) * | 2010-12-30 | 2013-08-21 | Kinik Co | Heat dissipation device |
| WO2012154490A1 (en) * | 2011-05-11 | 2012-11-15 | Memc Singapore Pte, Ltd. | Directional solidification furnace heat exchanger |
| US9139931B2 (en) | 2011-05-11 | 2015-09-22 | Memc Singapore Pte. Ltd. | Directional solidification furnace heat exchanger |
| TWI566675B (en) * | 2013-08-12 | 2017-01-11 | 宏碁股份有限公司 | Cycling heat dissipation module |
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