JPS57104246A - Cooling body - Google Patents

Cooling body

Info

Publication number
JPS57104246A
JPS57104246A JP18088080A JP18088080A JPS57104246A JP S57104246 A JPS57104246 A JP S57104246A JP 18088080 A JP18088080 A JP 18088080A JP 18088080 A JP18088080 A JP 18088080A JP S57104246 A JPS57104246 A JP S57104246A
Authority
JP
Japan
Prior art keywords
fins
base body
cooling body
refrigerant liquid
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18088080A
Other languages
Japanese (ja)
Inventor
Masao Fujii
Yoshiyuki Morihiro
Yoshio Seichi
Kiyoshi Kasahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18088080A priority Critical patent/JPS57104246A/en
Publication of JPS57104246A publication Critical patent/JPS57104246A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve the characteristics of heat transmission, and to prevent thermal fracture in a semiconductor element, etc. by dividing the cooling body into a base body and a fin and roughening each surface. CONSTITUTION:The cooling body is divided into the base body 1 and the fins 2, grid grains 6 consisting of iron, etc. are jetted from a nozzle 7 and made collide onto each heat transfer surface contacting with a coolant, and the surfaces are roughened. Accordingly, a section, which is difficult to be treated, such as the clearance sections of the fins can also be treated uniformly because the surfaces are roughened under a condition that the base body 1 and the fins 2 are each divided. After the roughening is completed, the base body 1 and the fins 2 are assembled and the cooling body is formed. Heat is radiated into the refrigerant liquid through the heat transmission of boiling from the heat transfer surfaces contacting with the refrigerant liquid of the base body 1 and the fins 2 by immersing the cooling body into the refrigerant liquid.
JP18088080A 1980-12-19 1980-12-19 Cooling body Pending JPS57104246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18088080A JPS57104246A (en) 1980-12-19 1980-12-19 Cooling body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18088080A JPS57104246A (en) 1980-12-19 1980-12-19 Cooling body

Publications (1)

Publication Number Publication Date
JPS57104246A true JPS57104246A (en) 1982-06-29

Family

ID=16090944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18088080A Pending JPS57104246A (en) 1980-12-19 1980-12-19 Cooling body

Country Status (1)

Country Link
JP (1) JPS57104246A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025153U (en) * 1983-07-27 1985-02-20 昭和アルミニウム株式会社 cooling fins
JP2016040505A (en) * 2014-08-12 2016-03-24 国立大学法人横浜国立大学 Cooler, cooling device using the same, and cooling method of heating element
EP2387071B1 (en) * 2006-03-23 2021-07-21 CeramTec GmbH Carrier body for components or circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025153U (en) * 1983-07-27 1985-02-20 昭和アルミニウム株式会社 cooling fins
EP2387071B1 (en) * 2006-03-23 2021-07-21 CeramTec GmbH Carrier body for components or circuits
JP2016040505A (en) * 2014-08-12 2016-03-24 国立大学法人横浜国立大学 Cooler, cooling device using the same, and cooling method of heating element

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