JPS56100293A - Cooler device - Google Patents

Cooler device

Info

Publication number
JPS56100293A
JPS56100293A JP294080A JP294080A JPS56100293A JP S56100293 A JPS56100293 A JP S56100293A JP 294080 A JP294080 A JP 294080A JP 294080 A JP294080 A JP 294080A JP S56100293 A JPS56100293 A JP S56100293A
Authority
JP
Japan
Prior art keywords
heat pipe
fins
closed end
block
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP294080A
Other languages
Japanese (ja)
Inventor
Sadao Okaya
Hideo Furuya
Atsuo Kobayashi
Tadashi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Oki Electric Cable Co Ltd
Original Assignee
Toshiba Corp
Oki Electric Cable Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Oki Electric Cable Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP294080A priority Critical patent/JPS56100293A/en
Publication of JPS56100293A publication Critical patent/JPS56100293A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve an efficiency of radiation and heat receiving operation by a method wherein when a heat pipe is utilized to cool an LSI etc., a closed end of the heat pipe is inserted into a block member having a better thermoconductivity and some fins are arranged at the exposed heat pipe.
CONSTITUTION: Closed end 12a of heat pipe 12 is inserted into a clock member 11 made of a metal having a better thermoconductivity combined with each other by solder etc. and the fins 14 are arranged at the part projecting from the block member 11. Thereby, the fins 14 attaching part has no closed end 12a of the heat pipe 12 as in a conventional manner, all the exposed parts of the heat pipe 12 may effectively be used as a radiating part under a cooperation of the fins 14. Thus, when the closed end 12a is projected oppositely from the block 11, all the connection parts between the block 11 and the heat pipe 12 may be made as a heat receiving part. Thereby, a radiation having a high efficiency may be provided.
COPYRIGHT: (C)1981,JPO&Japio
JP294080A 1980-01-14 1980-01-14 Cooler device Pending JPS56100293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP294080A JPS56100293A (en) 1980-01-14 1980-01-14 Cooler device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP294080A JPS56100293A (en) 1980-01-14 1980-01-14 Cooler device

Publications (1)

Publication Number Publication Date
JPS56100293A true JPS56100293A (en) 1981-08-12

Family

ID=11543348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP294080A Pending JPS56100293A (en) 1980-01-14 1980-01-14 Cooler device

Country Status (1)

Country Link
JP (1) JPS56100293A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539583A1 (en) * 1989-02-06 1993-05-05 The Furukawa Electric Co., Ltd. Method of producing heat pipe-type semiconductor cooling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539583A1 (en) * 1989-02-06 1993-05-05 The Furukawa Electric Co., Ltd. Method of producing heat pipe-type semiconductor cooling device

Similar Documents

Publication Publication Date Title
JPS56100293A (en) Cooler device
JPS53113354A (en) Thermostatic oven for electronic cooling
JPS53126276A (en) Heat dissipation construction of multichip mounting substrate
JPS53107767A (en) Air-cooled heat pump type cooling/heating device
JPS5438771A (en) Cooling fin
JPS56100292A (en) Cooler device
JPS5251150A (en) Manufacturing method for heat exchanger
JPS52132701A (en) Console containing electronic equipment
JPS5380042A (en) Evaporator for refrigerator
JPS52131247A (en) Evaporator
JPS5350662A (en) Microwave tube providing heat pipe cooler
JPS5277903A (en) Condenser
JPS51148373A (en) Cooling device
JPS53122161A (en) Boiling cooler
JPS5211769A (en) Method of adhering semiconductor proper and semiconductor holder
JPS542564A (en) Cold trap device
JPS534250A (en) Aluminium heat exchanger
JPS52147356A (en) Heat transfer pipe for condenser
JPS5252259A (en) Manufacturing method of aluminium heat exchanger
JPS53129973A (en) Semiconductor device
JPS5362098A (en) Liquid metal cooling type reactor
JPS5423244A (en) Manufacturing method for plate fin type heat exchanger
JPS5430551A (en) Natural air-cooling type heat exchanger
JPS5256429A (en) Cooling device using cooling effect of lng
JPS51129179A (en) Cooling radiator