JPS5698852A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5698852A
JPS5698852A JP132380A JP132380A JPS5698852A JP S5698852 A JPS5698852 A JP S5698852A JP 132380 A JP132380 A JP 132380A JP 132380 A JP132380 A JP 132380A JP S5698852 A JPS5698852 A JP S5698852A
Authority
JP
Japan
Prior art keywords
lead
dam
outer frame
tab
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP132380A
Other languages
Japanese (ja)
Other versions
JPS634354B2 (en
Inventor
Kazuo Shimizu
Fumihito Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP132380A priority Critical patent/JPS5698852A/en
Publication of JPS5698852A publication Critical patent/JPS5698852A/en
Publication of JPS634354B2 publication Critical patent/JPS634354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the mechanical strength and the level balance of the lead frame, by forming the deformable portions on the connecting part between the lead portion consisting of the tab, lead and dam of the lead frame and the outer frame, the said portion being subject to deformation in the level direction caused by heat stress. CONSTITUTION:The lead portion 11 consisting of the tab 3, lead 5 and dam 6 is connected to the outer frame 2 by the connecting portion consisting of the tab lead 4, dam extention 7 and lateral supporter 8. Each connected portion is incorporated into a single entity. That is to say, the tab 3 is connected to the outer frame 2 by a pair of tab lead 4, and the dam 6 with leads is connected to the outer frame 2 by the dam extensions extended in four directions, and the dam 6 without lead 4 is connected to the outer frame 2 by the lateral supporter 8. In this formation, the easy deformable portion 14 of the crooked shape is formed between the dam 3 and the outer frame 2, where the heat stress in the level direction can be absorbed.
JP132380A 1980-01-11 1980-01-11 Lead frame Granted JPS5698852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP132380A JPS5698852A (en) 1980-01-11 1980-01-11 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP132380A JPS5698852A (en) 1980-01-11 1980-01-11 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30642586A Division JPS62169334A (en) 1986-12-24 1986-12-24 Assembling method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5698852A true JPS5698852A (en) 1981-08-08
JPS634354B2 JPS634354B2 (en) 1988-01-28

Family

ID=11498277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP132380A Granted JPS5698852A (en) 1980-01-11 1980-01-11 Lead frame

Country Status (1)

Country Link
JP (1) JPS5698852A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821362A (en) * 1981-07-30 1983-02-08 Shinko Electric Ind Co Ltd Lead frame
JPS58182438U (en) * 1982-05-31 1983-12-05 富士通株式会社 semiconductor equipment
JPS62254456A (en) * 1986-04-26 1987-11-06 Yamada Seisakusho:Kk Lead frame
JPS63148670A (en) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd Lead frame material
JP2005216968A (en) * 2004-01-27 2005-08-11 Matsushita Electric Works Ltd Circuit board and manufacturing method therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821362A (en) * 1981-07-30 1983-02-08 Shinko Electric Ind Co Ltd Lead frame
JPS58182438U (en) * 1982-05-31 1983-12-05 富士通株式会社 semiconductor equipment
JPS62254456A (en) * 1986-04-26 1987-11-06 Yamada Seisakusho:Kk Lead frame
JPH0467785B2 (en) * 1986-04-26 1992-10-29 Yamada Seisakusho Kk
JPS63148670A (en) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd Lead frame material
JP2005216968A (en) * 2004-01-27 2005-08-11 Matsushita Electric Works Ltd Circuit board and manufacturing method therefor

Also Published As

Publication number Publication date
JPS634354B2 (en) 1988-01-28

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