JPS5689954A - Ink jetting apparatus - Google Patents
Ink jetting apparatusInfo
- Publication number
- JPS5689954A JPS5689954A JP16801779A JP16801779A JPS5689954A JP S5689954 A JPS5689954 A JP S5689954A JP 16801779 A JP16801779 A JP 16801779A JP 16801779 A JP16801779 A JP 16801779A JP S5689954 A JPS5689954 A JP S5689954A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- accommodating chamber
- cylindrical partition
- ink accommodating
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/02—Ink jet characterised by the jet generation process generating a continuous ink jet
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
PURPOSE:To simplify the construction of the ink jetting apparatus and to increase the precision for assembling it, by providing a single nozzle, fitting a cylindrical partition into an ink accommodating chamber, and supplying the ink between the cylindrical partition and the inner circumferential wall of the ink accommodating chamber. CONSTITUTION:The ink accommodating chamber 3 has a conical section 3a tapered toward a jetting nozzle 2, and to the back of the ink accommodating chamber 3 is provided a vibrating member 4 having a piezoelectric element bonded thereto. The cylindrical partition 6 is fitted and abuts on the vibrating member 4 so that a prescribed space 7 is formed between the cylindrical partition 6 and the inner wall of the ink accommodating chamber 3. Since there is the cylindrical partition 6 in the ink accommodating chamber 3, and the major part of the ink cannot be directly related with an ink supplying pipe 9, the transmission of the vibration pressure through the space 7 is low, the loss is reduced, and the transmission of the vibration to the nozzle is increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16801779A JPS5689954A (en) | 1979-12-24 | 1979-12-24 | Ink jetting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16801779A JPS5689954A (en) | 1979-12-24 | 1979-12-24 | Ink jetting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5689954A true JPS5689954A (en) | 1981-07-21 |
Family
ID=15860254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16801779A Pending JPS5689954A (en) | 1979-12-24 | 1979-12-24 | Ink jetting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5689954A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345176A (en) * | 2000-02-28 | 2001-12-14 | Semiconductor Energy Lab Co Ltd | Thin film forming device, thin film forming method therefor and spontaneous light emitting device |
-
1979
- 1979-12-24 JP JP16801779A patent/JPS5689954A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345176A (en) * | 2000-02-28 | 2001-12-14 | Semiconductor Energy Lab Co Ltd | Thin film forming device, thin film forming method therefor and spontaneous light emitting device |
JP4601842B2 (en) * | 2000-02-28 | 2010-12-22 | 株式会社半導体エネルギー研究所 | Thin film formation method |
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