JPS5679455A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5679455A
JPS5679455A JP15707079A JP15707079A JPS5679455A JP S5679455 A JPS5679455 A JP S5679455A JP 15707079 A JP15707079 A JP 15707079A JP 15707079 A JP15707079 A JP 15707079A JP S5679455 A JPS5679455 A JP S5679455A
Authority
JP
Japan
Prior art keywords
package
capacitance
pads
electrode
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15707079A
Other languages
Japanese (ja)
Inventor
Tomoji Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP15707079A priority Critical patent/JPS5679455A/en
Publication of JPS5679455A publication Critical patent/JPS5679455A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the lowering of the integration degree by forming a capacitance between electrode layers inside and on the surface of a package so as to be connected to ICs incorporated. CONSTITUTION:An IC 11 is mounted in a recess 2 of a package 1 made of an alumina ceramic and connected to a diatouch 6, which is connected to an electrode layer 7 arranged in the package. Pads 10 on the top of IC are connected to a junction post 4 and one of the pads is connected to an electrode layer 7 with the same area arranged on the surface of the package 1 facing the electrode 7 to form a capacitance 9 between electrodes 7 and 8. This enables connection of a sufficient capacitance to a substrate or the like of a circuit without externally mounting additional capacitance.
JP15707079A 1979-12-04 1979-12-04 Semiconductor device Pending JPS5679455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15707079A JPS5679455A (en) 1979-12-04 1979-12-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15707079A JPS5679455A (en) 1979-12-04 1979-12-04 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5679455A true JPS5679455A (en) 1981-06-30

Family

ID=15641567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15707079A Pending JPS5679455A (en) 1979-12-04 1979-12-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5679455A (en)

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