JPS5336184A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5336184A
JPS5336184A JP11119176A JP11119176A JPS5336184A JP S5336184 A JPS5336184 A JP S5336184A JP 11119176 A JP11119176 A JP 11119176A JP 11119176 A JP11119176 A JP 11119176A JP S5336184 A JPS5336184 A JP S5336184A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
substrate
miniaturize
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11119176A
Other languages
Japanese (ja)
Inventor
Yoshihiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11119176A priority Critical patent/JPS5336184A/en
Publication of JPS5336184A publication Critical patent/JPS5336184A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To reduce the area of electrode portion and miniaturize an LSI by providing lead-out electrodes for ICs constituted on the surface of a Si substrate on the back of the substrate.
JP11119176A 1976-09-16 1976-09-16 Semiconductor integrated circuit Pending JPS5336184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11119176A JPS5336184A (en) 1976-09-16 1976-09-16 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11119176A JPS5336184A (en) 1976-09-16 1976-09-16 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5336184A true JPS5336184A (en) 1978-04-04

Family

ID=14554796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11119176A Pending JPS5336184A (en) 1976-09-16 1976-09-16 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5336184A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54147970A (en) * 1978-05-09 1979-11-19 Union Carbide Corp Smoking liquor composition with improved quality and food casing made from said composition
JPS5623768A (en) * 1979-08-03 1981-03-06 Nec Corp Semiconductor device
JPS5843554A (en) * 1981-09-08 1983-03-14 Mitsubishi Electric Corp Semiconductor device
JPS5891654A (en) * 1981-11-26 1983-05-31 Mitsubishi Electric Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54147970A (en) * 1978-05-09 1979-11-19 Union Carbide Corp Smoking liquor composition with improved quality and food casing made from said composition
JPS5623768A (en) * 1979-08-03 1981-03-06 Nec Corp Semiconductor device
JPS5843554A (en) * 1981-09-08 1983-03-14 Mitsubishi Electric Corp Semiconductor device
JPS5891654A (en) * 1981-11-26 1983-05-31 Mitsubishi Electric Corp Semiconductor device

Similar Documents

Publication Publication Date Title
JPS53123074A (en) Semiconductor device
JPS5336184A (en) Semiconductor integrated circuit
JPS5360582A (en) Semiconductor ingegrated circuit device
JPS5336185A (en) Electrode lead-out method of semiconductor integrated circuit
JPS52122090A (en) Semiconductor integrated circuit device
JPS5220769A (en) Longitudinal semi-conductor unit
JPS5618469A (en) Semiconductor device
JPS539488A (en) Production of semiconductor device
JPS542076A (en) Manufacture for semiconductor device
JPS5394191A (en) Semiconductor device
JPS5357775A (en) Semiconductor ingegrated circuit device
JPS5343484A (en) Semiconductor integrated circuit device
JPS526458A (en) Integrated semi-conductor logicalcircuit
JPS52142974A (en) Semiconductor device
JPS5339087A (en) Integrated circuit
JPS52129385A (en) Productoon of bipolar integrated circuit device
JPS5384580A (en) Manufacture for semiconductor device
JPS537182A (en) Multilayer structure semiconductor integrated circuit device
JPS548482A (en) Semiconductor integrated circuit device
SE7707068L (en) SEMICONDUCTOR CIRCUIT DIP
JPS5248970A (en) Semiconductor device
JPS53118985A (en) Semiconductor device
JPS57211741A (en) Semiconductor device
JPS52129383A (en) Mis semicnductor integrated circuit device
JPS53143183A (en) Semicondutor integrated circuit device and production of the same

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 8

Free format text: PAYMENT UNTIL: 20081124

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 8

Free format text: PAYMENT UNTIL: 20081124

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091124

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 10

Free format text: PAYMENT UNTIL: 20101124

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101124

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111124

Year of fee payment: 11

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 11

Free format text: PAYMENT UNTIL: 20111124