JPS5669876A - Manufacture of silicon avalanche photo-diode - Google Patents

Manufacture of silicon avalanche photo-diode

Info

Publication number
JPS5669876A
JPS5669876A JP14826879A JP14826879A JPS5669876A JP S5669876 A JPS5669876 A JP S5669876A JP 14826879 A JP14826879 A JP 14826879A JP 14826879 A JP14826879 A JP 14826879A JP S5669876 A JPS5669876 A JP S5669876A
Authority
JP
Japan
Prior art keywords
film
sio2
poly
diode
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14826879A
Other languages
Japanese (ja)
Inventor
Seiichi Nagai
Kazuhisa Takahashi
Saburo Takamiya
Wataru Suzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14826879A priority Critical patent/JPS5669876A/en
Publication of JPS5669876A publication Critical patent/JPS5669876A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/107Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To improve yield and reliability by a method wherein mesa grooves at where a P-N junction is terminated are covered with pure thermal oxide films, poly Si with high specific resistance is filled into the grooves, and the surfaces of the poly Si are coated with an insulating film. CONSTITUTION:A P epitaxial layer 2 on an N<+> type Si substrate 1 is covered with an SiO2 mask 4, mesa grooves 14 are formed, and SiO2 thin-films 12 are made up on inclined planes. Poly Si11 with high specific resistance is filled to lap up to a surface of the SiO2 film 4. The film 4 is coated with a CVD SiO2 film 9, a hole is selectively made to the films 9, 4, and a P<+> connecting layer 3 is made up. An electrode 6 and a reflection preventive film 13 are built up, thus completing a diode. According to this constitution, a device by means of a P layer side injection system advantageous on characteristics is easily obtained in excellent yield and high reliability.
JP14826879A 1979-11-12 1979-11-12 Manufacture of silicon avalanche photo-diode Pending JPS5669876A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14826879A JPS5669876A (en) 1979-11-12 1979-11-12 Manufacture of silicon avalanche photo-diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14826879A JPS5669876A (en) 1979-11-12 1979-11-12 Manufacture of silicon avalanche photo-diode

Publications (1)

Publication Number Publication Date
JPS5669876A true JPS5669876A (en) 1981-06-11

Family

ID=15448963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14826879A Pending JPS5669876A (en) 1979-11-12 1979-11-12 Manufacture of silicon avalanche photo-diode

Country Status (1)

Country Link
JP (1) JPS5669876A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0913003A1 (en) * 1996-07-03 1999-05-06 Advanced Photonix, Inc. Avalanching semiconductor device having an epitaxially grown layer
JP2007227750A (en) * 2006-02-24 2007-09-06 Seiko Instruments Inc Semiconductor device and its manufacturing method
JP2014518458A (en) * 2011-07-08 2014-07-28 エクセリタス カナダ,インコーポレイテッド Photon counting UV-APD
EP3939093A4 (en) * 2019-03-12 2022-12-14 Dephan Limited Liability Company (Dephan LLC) Avalanche photodetector (variants) and method for manufacturing the same (variants)
EP3939095A4 (en) * 2019-03-12 2022-12-14 Dephan Limited Liability Company (Dephan LLC) Avalanche photodetector (variants) and method for manufacturing the same (variants)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0913003A1 (en) * 1996-07-03 1999-05-06 Advanced Photonix, Inc. Avalanching semiconductor device having an epitaxially grown layer
EP0913003A4 (en) * 1996-07-03 1999-08-25 Advanced Photonix Inc Avalanching semiconductor device having an epitaxially grown layer
JP2007227750A (en) * 2006-02-24 2007-09-06 Seiko Instruments Inc Semiconductor device and its manufacturing method
JP4584159B2 (en) * 2006-02-24 2010-11-17 セイコーインスツル株式会社 Semiconductor device and manufacturing method of semiconductor device
JP2014518458A (en) * 2011-07-08 2014-07-28 エクセリタス カナダ,インコーポレイテッド Photon counting UV-APD
EP3939093A4 (en) * 2019-03-12 2022-12-14 Dephan Limited Liability Company (Dephan LLC) Avalanche photodetector (variants) and method for manufacturing the same (variants)
EP3939095A4 (en) * 2019-03-12 2022-12-14 Dephan Limited Liability Company (Dephan LLC) Avalanche photodetector (variants) and method for manufacturing the same (variants)

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