JPS5656669A - Semiconductor device - Google Patents

Abstract

PURPOSE:To shorten a time required for assembly by a method wherein a jig having a hole for insertion of a lead wire and a concavity, and a base having a concavity in the lower surface thereof corresponding to the concavity of the jig are employed and an element is situated in the concavity when a cathode wire, a gate lead wire and the like are brazed to the semiconductor element. CONSTITUTION:Brazing of a prescribed lead wire to the semiconductor element 4 is performed by using the jig 1 which has a piercing hole and a concavity in the surface thereof and the base 6 which has a concavity as well in the back surface thereof in opposition to the concavity of the jig. That is, the concavity for housing the semiconductor element 4 is provided in the surface of the jig 1, a lower electrode 3 with a brazing agent is laid on the bottom surface of the concavity and the element 4 is arranged thereon, while the lead wire 7 with soldar and the cathode lead wire 2 are inserted toward the element 4 respectively into the two piercing holes provided in the jig 1. Next, the base 6 having the concavity corresponding to the element 4 is directed downward and placed on the jig 1, while containing an upper metal 5 with the brazing agent in the concavity thereof, and then these are united through fusion by heating.