JPS5643740A - Semiconductor wafer - Google Patents
Semiconductor waferInfo
- Publication number
- JPS5643740A JPS5643740A JP11899779A JP11899779A JPS5643740A JP S5643740 A JPS5643740 A JP S5643740A JP 11899779 A JP11899779 A JP 11899779A JP 11899779 A JP11899779 A JP 11899779A JP S5643740 A JPS5643740 A JP S5643740A
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- scrive
- semiconductor wafer
- cutting
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 6
- 235000012431 wafers Nutrition 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 230000007306 turnover Effects 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11899779A JPS5643740A (en) | 1979-09-17 | 1979-09-17 | Semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11899779A JPS5643740A (en) | 1979-09-17 | 1979-09-17 | Semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5643740A true JPS5643740A (en) | 1981-04-22 |
Family
ID=14750439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11899779A Pending JPS5643740A (en) | 1979-09-17 | 1979-09-17 | Semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5643740A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61125040A (en) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | Semiconductor device |
JPS61150268A (en) * | 1984-12-24 | 1986-07-08 | Hitachi Ltd | Manufacture of semiconductor device |
JPS6373536A (en) * | 1986-09-16 | 1988-04-04 | Seiko Epson Corp | Semiconductor integrated circuit |
EP0343720A2 (en) * | 1988-05-23 | 1989-11-29 | Koninklijke Philips Electronics N.V. | Semiconductor wafer and method of dividing it |
JPH03139862A (en) * | 1989-10-25 | 1991-06-14 | Fujitsu Ltd | Semiconductor device |
US5096855A (en) * | 1988-05-23 | 1992-03-17 | U.S. Philips Corporation | Method of dicing semiconductor wafers which produces shards less than 10 microns in size |
US5206181A (en) * | 1991-06-03 | 1993-04-27 | Motorola, Inc. | Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing |
-
1979
- 1979-09-17 JP JP11899779A patent/JPS5643740A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61125040A (en) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | Semiconductor device |
JPS61150268A (en) * | 1984-12-24 | 1986-07-08 | Hitachi Ltd | Manufacture of semiconductor device |
JPS6373536A (en) * | 1986-09-16 | 1988-04-04 | Seiko Epson Corp | Semiconductor integrated circuit |
EP0343720A2 (en) * | 1988-05-23 | 1989-11-29 | Koninklijke Philips Electronics N.V. | Semiconductor wafer and method of dividing it |
US5096855A (en) * | 1988-05-23 | 1992-03-17 | U.S. Philips Corporation | Method of dicing semiconductor wafers which produces shards less than 10 microns in size |
JPH03139862A (en) * | 1989-10-25 | 1991-06-14 | Fujitsu Ltd | Semiconductor device |
US5206181A (en) * | 1991-06-03 | 1993-04-27 | Motorola, Inc. | Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing |
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Legal Events
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