JPS5641397A - Copper-group material excellent in resistance to corrosion - Google Patents
Copper-group material excellent in resistance to corrosionInfo
- Publication number
- JPS5641397A JPS5641397A JP11609979A JP11609979A JPS5641397A JP S5641397 A JPS5641397 A JP S5641397A JP 11609979 A JP11609979 A JP 11609979A JP 11609979 A JP11609979 A JP 11609979A JP S5641397 A JPS5641397 A JP S5641397A
- Authority
- JP
- Japan
- Prior art keywords
- plated layer
- copper
- group material
- tin
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract 5
- 238000005260 corrosion Methods 0.000 title abstract 3
- 230000007797 corrosion Effects 0.000 title abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 2
- 229910052793 cadmium Inorganic materials 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Abstract
PURPOSE:To increase the resistance to stress corrosion crack for the copper-group material, by providing the intermediate plated layer composed of the Zn and Cd or one or more kinds of their alloys to the copper-group material and then adding the plated layer of the tin or tin alloy to the outside of the intermediate plated layer. CONSTITUTION:The intermediate plated layer composed of the Zn and Cd or one or more kinds of their alloys is provided to the copper-group material via the electroplating method or the like, and then the plated layer of the tin or the tin alloy is formed to the outside of the intermediate plated layer. Furthermore, the second intermediate plated layer composed of the Ni, Co, Cu, Pb, Ag and Au or one or more kinds of their alloys is provided when necessary between the first intermediate played layer and the outside plated layer via the electroplating method or the like. In such way the first and second intermediate plated layers are provided in order to increase anticorrosion performance to the stress corrosion crack which is caused when the tin plating is applied directly to the copper-group material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11609979A JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11609979A JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5641397A true JPS5641397A (en) | 1981-04-18 |
Family
ID=14678670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11609979A Pending JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5641397A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60116787A (en) * | 1983-11-30 | 1985-06-24 | Mitsubishi Heavy Ind Ltd | Method and device for plating |
| JPS60169589A (en) * | 1984-02-13 | 1985-09-03 | Furukawa Electric Co Ltd:The | Copper alloy material containing phosphorus coated with tin or tin alloy |
| JPS6342393A (en) * | 1986-08-06 | 1988-02-23 | Kobe Steel Ltd | Method for tin or tin alloy plating copper or copper alloy wire |
| JPH01259194A (en) * | 1988-04-11 | 1989-10-16 | Hitachi Metals Ltd | Corrosion resistant piping parts |
| JPH02301546A (en) * | 1989-05-15 | 1990-12-13 | Furukawa Electric Co Ltd:The | Sn or sn alloy coating material |
| US5759379A (en) * | 1996-04-26 | 1998-06-02 | International Business Machines Corporation | Solder method |
| US6584040B1 (en) | 1997-04-25 | 2003-06-24 | Seiko Instruments Inc. | Electronic timepiece |
| JP2006322014A (en) * | 2005-05-17 | 2006-11-30 | Univ Waseda | Plating liquid, plating film, and method for producing the same |
| WO2009008526A1 (en) * | 2007-07-06 | 2009-01-15 | Ddk Ltd. | Process for producing electronic component, and electronic component produced by the process |
| EP3705606A4 (en) * | 2017-10-30 | 2021-10-13 | Mitsubishi Materials Corporation | Anticorrosive terminal material, anticorrosive terminal, and electric wire end structure |
-
1979
- 1979-09-12 JP JP11609979A patent/JPS5641397A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60116787A (en) * | 1983-11-30 | 1985-06-24 | Mitsubishi Heavy Ind Ltd | Method and device for plating |
| JPS60169589A (en) * | 1984-02-13 | 1985-09-03 | Furukawa Electric Co Ltd:The | Copper alloy material containing phosphorus coated with tin or tin alloy |
| JPS6342393A (en) * | 1986-08-06 | 1988-02-23 | Kobe Steel Ltd | Method for tin or tin alloy plating copper or copper alloy wire |
| JPH01259194A (en) * | 1988-04-11 | 1989-10-16 | Hitachi Metals Ltd | Corrosion resistant piping parts |
| JPH02301546A (en) * | 1989-05-15 | 1990-12-13 | Furukawa Electric Co Ltd:The | Sn or sn alloy coating material |
| US5759379A (en) * | 1996-04-26 | 1998-06-02 | International Business Machines Corporation | Solder method |
| US6584040B1 (en) | 1997-04-25 | 2003-06-24 | Seiko Instruments Inc. | Electronic timepiece |
| JP2006322014A (en) * | 2005-05-17 | 2006-11-30 | Univ Waseda | Plating liquid, plating film, and method for producing the same |
| JP4712439B2 (en) * | 2005-05-17 | 2011-06-29 | 学校法人早稲田大学 | Plating solution, plating film and manufacturing method thereof |
| WO2009008526A1 (en) * | 2007-07-06 | 2009-01-15 | Ddk Ltd. | Process for producing electronic component, and electronic component produced by the process |
| US8092263B2 (en) | 2007-07-06 | 2012-01-10 | Ddk Ltd. | Process for producing connector and connector produced by the same process |
| JP5215305B2 (en) * | 2007-07-06 | 2013-06-19 | 第一電子工業株式会社 | Electronic component manufacturing method and electronic component manufactured by the method |
| EP3705606A4 (en) * | 2017-10-30 | 2021-10-13 | Mitsubishi Materials Corporation | Anticorrosive terminal material, anticorrosive terminal, and electric wire end structure |
| US11661667B2 (en) | 2017-10-30 | 2023-05-30 | Mitsubishi Materials Corporation | Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure |
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