JPS5639190A - Laser processing machine - Google Patents

Laser processing machine

Info

Publication number
JPS5639190A
JPS5639190A JP11549979A JP11549979A JPS5639190A JP S5639190 A JPS5639190 A JP S5639190A JP 11549979 A JP11549979 A JP 11549979A JP 11549979 A JP11549979 A JP 11549979A JP S5639190 A JPS5639190 A JP S5639190A
Authority
JP
Japan
Prior art keywords
hole
objective
slit
laser light
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11549979A
Other languages
Japanese (ja)
Inventor
Koichi Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11549979A priority Critical patent/JPS5639190A/en
Publication of JPS5639190A publication Critical patent/JPS5639190A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To simply perform the hole making with good accuracy, by providing the slit plate having the slit hole in response to the shape of hole made to the hole making objective, in the optical system to squeeze the laser light. CONSTITUTION:In making holes on the objective 7 on the table 9 with laser light, the light from the laser light generator 1 is radiated on the objective 7 via the concave lens 3, slit plate 8, convex lens 4, reflection mirror 6 and convex lens 5. In this case, in response to the shape of hole for the objective 7, the slit hole 8a is provided with the slit plate 8. Thus, the hole is drilled without moving the table 9. When the objective 7 is the cantilever of pickup cartridge, the slightly smaller hole than the required hole is taken as slit hole 8a. Further, in case of square hole, it can surely be obtained with slightly curved shape.
JP11549979A 1979-09-07 1979-09-07 Laser processing machine Pending JPS5639190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11549979A JPS5639190A (en) 1979-09-07 1979-09-07 Laser processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11549979A JPS5639190A (en) 1979-09-07 1979-09-07 Laser processing machine

Publications (1)

Publication Number Publication Date
JPS5639190A true JPS5639190A (en) 1981-04-14

Family

ID=14664013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11549979A Pending JPS5639190A (en) 1979-09-07 1979-09-07 Laser processing machine

Country Status (1)

Country Link
JP (1) JPS5639190A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61238489A (en) * 1985-04-17 1986-10-23 Nippon Kogaku Kk <Nikon> Optical device for laser beam processing
JPH04339585A (en) * 1991-05-13 1992-11-26 Canon Inc Drilling machine
DE102007020704A1 (en) * 2007-05-03 2008-11-13 Carl Baasel Lasertechnik Gmbh & Co. Kg Device for processing a workpiece using a laser beam comprises a beam shaping unit for shaping the intensity profile of the laser beam leaving an aperture and a screen arranged in the beam path between the aperture and the processing plane
DE102015206004A1 (en) * 2015-04-02 2016-10-06 Siemens Aktiengesellschaft Apparatus and method for forming a long pulse laser and method for making a shaped hole

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61238489A (en) * 1985-04-17 1986-10-23 Nippon Kogaku Kk <Nikon> Optical device for laser beam processing
JPH04339585A (en) * 1991-05-13 1992-11-26 Canon Inc Drilling machine
DE102007020704A1 (en) * 2007-05-03 2008-11-13 Carl Baasel Lasertechnik Gmbh & Co. Kg Device for processing a workpiece using a laser beam comprises a beam shaping unit for shaping the intensity profile of the laser beam leaving an aperture and a screen arranged in the beam path between the aperture and the processing plane
DE102007020704B4 (en) * 2007-05-03 2010-05-27 Carl Baasel Lasertechnik Gmbh & Co. Kg Device for processing a workpiece with a laser beam
DE102015206004A1 (en) * 2015-04-02 2016-10-06 Siemens Aktiengesellschaft Apparatus and method for forming a long pulse laser and method for making a shaped hole

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