JPS5637654A - Semiconductor element container - Google Patents

Semiconductor element container

Info

Publication number
JPS5637654A
JPS5637654A JP11332879A JP11332879A JPS5637654A JP S5637654 A JPS5637654 A JP S5637654A JP 11332879 A JP11332879 A JP 11332879A JP 11332879 A JP11332879 A JP 11332879A JP S5637654 A JPS5637654 A JP S5637654A
Authority
JP
Japan
Prior art keywords
layer
container
semiconductor element
cap
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11332879A
Other languages
Japanese (ja)
Inventor
Masato Nakajima
Akira Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11332879A priority Critical patent/JPS5637654A/en
Publication of JPS5637654A publication Critical patent/JPS5637654A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the accuracy of the external shape of a semiconductor element container of the type containing a semiconductor element in a recess formed on the surface of a laminated ceramic and sealing it with a cap by extending the periphery of container externally from the cap while maintaining the surface of placing the element as the same level as the periphery of the container. CONSTITUTION:The first ceramic layer 1 is formed of laminate ceramics, and a second ceramic layer 3 of ring shape is formed thereon as projected. Thus, a semiconductor element container is formed. Then, a semiconductor element 6 is soldered to the central portion on the surface 7 of the first layer 1 as surrounded by the second layer 3, and an electrode is connected to a metallized layer 2 formed on the first layer 2 using a fine bonding wire 8. Thereafter, an external lead wire 5 is connected to the end of the metallized layer 2 passing through the wall of the layer 3, and a cap 9 is fixed onto the surface of the second layer 3 using a low melting poing glass seal layer 10. Since the container may deform due to the sintering treatment in this configuration when forming the container, an externally extended exposed portion 4 is formed on the first layer 1 upon production of the container, and the deformation can be thus reduced at the container.
JP11332879A 1979-09-04 1979-09-04 Semiconductor element container Pending JPS5637654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11332879A JPS5637654A (en) 1979-09-04 1979-09-04 Semiconductor element container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11332879A JPS5637654A (en) 1979-09-04 1979-09-04 Semiconductor element container

Publications (1)

Publication Number Publication Date
JPS5637654A true JPS5637654A (en) 1981-04-11

Family

ID=14609448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11332879A Pending JPS5637654A (en) 1979-09-04 1979-09-04 Semiconductor element container

Country Status (1)

Country Link
JP (1) JPS5637654A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216322A (en) * 2014-05-13 2015-12-03 日本電気硝子株式会社 Manufacturing method of ceramic-glass composite package, and ceramic-glass composite package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216322A (en) * 2014-05-13 2015-12-03 日本電気硝子株式会社 Manufacturing method of ceramic-glass composite package, and ceramic-glass composite package

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