JPS5635439A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5635439A
JPS5635439A JP11034979A JP11034979A JPS5635439A JP S5635439 A JPS5635439 A JP S5635439A JP 11034979 A JP11034979 A JP 11034979A JP 11034979 A JP11034979 A JP 11034979A JP S5635439 A JPS5635439 A JP S5635439A
Authority
JP
Japan
Prior art keywords
housing
cylinder
accommodated
electrodes
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11034979A
Other languages
Japanese (ja)
Other versions
JPS6043016B2 (en
Inventor
Yoichi Araki
Kazuyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP54110349A priority Critical patent/JPS6043016B2/en
Publication of JPS5635439A publication Critical patent/JPS5635439A/en
Publication of JPS6043016B2 publication Critical patent/JPS6043016B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a high rupture resistance by interposing a synthetic resin cylinder which has an electrical insulation and a heat resistance, and is soft and elastic, at the peripheral part of a structure within the cylinder, when a semiconductor element structure held at its upper and lower parts between electrodes is accommodated in an insulating housing cylinder. CONSTITUTION:A pair of annular lids 2 and 2' are opposed to both end surfaces of an insulating housing 1 made of ceramics and the like, and fused together, and a semiconductor element structure 14 is accommodated in the housing 1, and both front and back surfaces of the structure 4 are held between electrodes 3 and 3' infiltrated in a through hole formed between the lids 2 and 2', thereby to form a semiconductor device. In this structure, between the inner periphery of the housing 1 and the outer periphery of the structure 14, there is inserted a cylindrical body 26 comprising a cylindrical part 26a such as silicone rubber, teflon or the like, having excellent electric insulation and heat resistance, and further elasticity, and a flange part 26b, and the peripheral edge of the structure 14 is pressed by the cylindrical part 26a. By said procedure, the rupture resistance of the device increases against an arc, and therefore said device is suitable for use in an apparatus requiring a large electric power.
JP54110349A 1979-08-31 1979-08-31 semiconductor equipment Expired JPS6043016B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54110349A JPS6043016B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54110349A JPS6043016B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5635439A true JPS5635439A (en) 1981-04-08
JPS6043016B2 JPS6043016B2 (en) 1985-09-26

Family

ID=14533501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54110349A Expired JPS6043016B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6043016B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0246539A2 (en) * 1986-05-16 1987-11-25 General Electric Company Improved silicon packages for power semiconductor devices
EP1906443A2 (en) 2006-09-26 2008-04-02 Mitsubishi Electric Corporation Pressure-contact semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216610A (en) * 1985-07-16 1987-01-24 Asahi Glass Co Ltd Container of ultrasonic delay line and its manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0246539A2 (en) * 1986-05-16 1987-11-25 General Electric Company Improved silicon packages for power semiconductor devices
EP1906443A2 (en) 2006-09-26 2008-04-02 Mitsubishi Electric Corporation Pressure-contact semiconductor device
EP1906443A3 (en) * 2006-09-26 2008-12-03 Mitsubishi Electric Corporation Pressure-contact semiconductor device
US8456001B2 (en) 2006-09-26 2013-06-04 Mitsubishi Electric Corporation Pressure-contact semiconductor device

Also Published As

Publication number Publication date
JPS6043016B2 (en) 1985-09-26

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