JPS5632724A - Photoresist applying apparatus - Google Patents
Photoresist applying apparatusInfo
- Publication number
- JPS5632724A JPS5632724A JP10725279A JP10725279A JPS5632724A JP S5632724 A JPS5632724 A JP S5632724A JP 10725279 A JP10725279 A JP 10725279A JP 10725279 A JP10725279 A JP 10725279A JP S5632724 A JPS5632724 A JP S5632724A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- resist
- dropped
- pump
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To obtain a high-quality mask-applied film by arranging a recieving pan for a dropping resist liquid under the nozzle and preventing the dropping of unnecessary materials. CONSTITUTION:At first, the position of a resist-dropping nozzle 3 is adjusted 4 by a control signal 1 so that the nozzle 3 is located outside a rotating support 5 and directly over a receiving pan 7. A pump 2 is driven by the signal 1, and a specified amount of the resist is dropped from the nozzle 3 into the pan 7. The solidified resist stuck to the nozzle tip is resolved again, separated, and dropped in the pan 7. Then, the pump 2 is stopped by the signal 1, a mask is absorbed to the rotating support 5 by vacuum, thereafter the nozzle 3 is moved 4 and aligned with the rotating shaft of the support 5. Then, the pump 2 is driven, and a specified amount thereof is dropped, but when the pump is stopped, the nozzle is returned to the original position. Thereafter, the motor 6 is rotated by the signal 1, and application of mask is performed. In this constitution, since the solidified resist or the foreign materials in the resist are not dropped on the substrate or the mask, a high-quality resist film can be applied.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10725279A JPS5632724A (en) | 1979-08-24 | 1979-08-24 | Photoresist applying apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10725279A JPS5632724A (en) | 1979-08-24 | 1979-08-24 | Photoresist applying apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5632724A true JPS5632724A (en) | 1981-04-02 |
Family
ID=14454330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10725279A Pending JPS5632724A (en) | 1979-08-24 | 1979-08-24 | Photoresist applying apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5632724A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59143044U (en) * | 1983-03-11 | 1984-09-25 | 富士通株式会社 | Resist coating equipment |
JPS60117728A (en) * | 1983-11-30 | 1985-06-25 | Canon Hanbai Kk | Nozzle shifter |
JPS60175569A (en) * | 1984-02-22 | 1985-09-09 | Nec Corp | Coating apparatus to semiconductor substrate |
JPS61112320A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Developing treating device for semiconductor substrate |
JPS6186930U (en) * | 1984-11-12 | 1986-06-07 | ||
JPS6230336U (en) * | 1985-08-07 | 1987-02-24 | ||
JPS6246521A (en) * | 1985-08-23 | 1987-02-28 | Mitsubishi Electric Corp | Resist coating device |
JPS6251221A (en) * | 1985-08-30 | 1987-03-05 | Nec Kyushu Ltd | Coating device |
JPS648621A (en) * | 1987-06-30 | 1989-01-12 | Fujitsu Ltd | Resist coating apparatus |
JPH0158934U (en) * | 1988-09-08 | 1989-04-13 | ||
JPH01205422A (en) * | 1988-02-10 | 1989-08-17 | Tokyo Electron Ltd | Resist coater |
JPH01227437A (en) * | 1988-03-07 | 1989-09-11 | Tokyo Electron Ltd | Developing device |
-
1979
- 1979-08-24 JP JP10725279A patent/JPS5632724A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342527Y2 (en) * | 1983-03-11 | 1988-11-08 | ||
JPS59143044U (en) * | 1983-03-11 | 1984-09-25 | 富士通株式会社 | Resist coating equipment |
JPS60117728A (en) * | 1983-11-30 | 1985-06-25 | Canon Hanbai Kk | Nozzle shifter |
JPS60175569A (en) * | 1984-02-22 | 1985-09-09 | Nec Corp | Coating apparatus to semiconductor substrate |
JPS61112320A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Developing treating device for semiconductor substrate |
JPS6186930U (en) * | 1984-11-12 | 1986-06-07 | ||
JPH0132358Y2 (en) * | 1984-11-12 | 1989-10-03 | ||
JPS6230336U (en) * | 1985-08-07 | 1987-02-24 | ||
JPS6246521A (en) * | 1985-08-23 | 1987-02-28 | Mitsubishi Electric Corp | Resist coating device |
JPS6251221A (en) * | 1985-08-30 | 1987-03-05 | Nec Kyushu Ltd | Coating device |
JPS648621A (en) * | 1987-06-30 | 1989-01-12 | Fujitsu Ltd | Resist coating apparatus |
JPH01205422A (en) * | 1988-02-10 | 1989-08-17 | Tokyo Electron Ltd | Resist coater |
JPH0760786B2 (en) * | 1988-02-10 | 1995-06-28 | 東京エレクトロン株式会社 | Resist coating device |
JPH01227437A (en) * | 1988-03-07 | 1989-09-11 | Tokyo Electron Ltd | Developing device |
JPH0158934U (en) * | 1988-09-08 | 1989-04-13 |
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