JPS5632724A - Photoresist applying apparatus - Google Patents

Photoresist applying apparatus

Info

Publication number
JPS5632724A
JPS5632724A JP10725279A JP10725279A JPS5632724A JP S5632724 A JPS5632724 A JP S5632724A JP 10725279 A JP10725279 A JP 10725279A JP 10725279 A JP10725279 A JP 10725279A JP S5632724 A JPS5632724 A JP S5632724A
Authority
JP
Japan
Prior art keywords
nozzle
resist
dropped
pump
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10725279A
Other languages
Japanese (ja)
Inventor
Nobuo Sato
Yoshiharu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10725279A priority Critical patent/JPS5632724A/en
Publication of JPS5632724A publication Critical patent/JPS5632724A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To obtain a high-quality mask-applied film by arranging a recieving pan for a dropping resist liquid under the nozzle and preventing the dropping of unnecessary materials. CONSTITUTION:At first, the position of a resist-dropping nozzle 3 is adjusted 4 by a control signal 1 so that the nozzle 3 is located outside a rotating support 5 and directly over a receiving pan 7. A pump 2 is driven by the signal 1, and a specified amount of the resist is dropped from the nozzle 3 into the pan 7. The solidified resist stuck to the nozzle tip is resolved again, separated, and dropped in the pan 7. Then, the pump 2 is stopped by the signal 1, a mask is absorbed to the rotating support 5 by vacuum, thereafter the nozzle 3 is moved 4 and aligned with the rotating shaft of the support 5. Then, the pump 2 is driven, and a specified amount thereof is dropped, but when the pump is stopped, the nozzle is returned to the original position. Thereafter, the motor 6 is rotated by the signal 1, and application of mask is performed. In this constitution, since the solidified resist or the foreign materials in the resist are not dropped on the substrate or the mask, a high-quality resist film can be applied.
JP10725279A 1979-08-24 1979-08-24 Photoresist applying apparatus Pending JPS5632724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10725279A JPS5632724A (en) 1979-08-24 1979-08-24 Photoresist applying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10725279A JPS5632724A (en) 1979-08-24 1979-08-24 Photoresist applying apparatus

Publications (1)

Publication Number Publication Date
JPS5632724A true JPS5632724A (en) 1981-04-02

Family

ID=14454330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10725279A Pending JPS5632724A (en) 1979-08-24 1979-08-24 Photoresist applying apparatus

Country Status (1)

Country Link
JP (1) JPS5632724A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143044U (en) * 1983-03-11 1984-09-25 富士通株式会社 Resist coating equipment
JPS60117728A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Nozzle shifter
JPS60175569A (en) * 1984-02-22 1985-09-09 Nec Corp Coating apparatus to semiconductor substrate
JPS61112320A (en) * 1984-11-07 1986-05-30 Nec Corp Developing treating device for semiconductor substrate
JPS6186930U (en) * 1984-11-12 1986-06-07
JPS6230336U (en) * 1985-08-07 1987-02-24
JPS6246521A (en) * 1985-08-23 1987-02-28 Mitsubishi Electric Corp Resist coating device
JPS6251221A (en) * 1985-08-30 1987-03-05 Nec Kyushu Ltd Coating device
JPS648621A (en) * 1987-06-30 1989-01-12 Fujitsu Ltd Resist coating apparatus
JPH0158934U (en) * 1988-09-08 1989-04-13
JPH01205422A (en) * 1988-02-10 1989-08-17 Tokyo Electron Ltd Resist coater
JPH01227437A (en) * 1988-03-07 1989-09-11 Tokyo Electron Ltd Developing device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342527Y2 (en) * 1983-03-11 1988-11-08
JPS59143044U (en) * 1983-03-11 1984-09-25 富士通株式会社 Resist coating equipment
JPS60117728A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Nozzle shifter
JPS60175569A (en) * 1984-02-22 1985-09-09 Nec Corp Coating apparatus to semiconductor substrate
JPS61112320A (en) * 1984-11-07 1986-05-30 Nec Corp Developing treating device for semiconductor substrate
JPS6186930U (en) * 1984-11-12 1986-06-07
JPH0132358Y2 (en) * 1984-11-12 1989-10-03
JPS6230336U (en) * 1985-08-07 1987-02-24
JPS6246521A (en) * 1985-08-23 1987-02-28 Mitsubishi Electric Corp Resist coating device
JPS6251221A (en) * 1985-08-30 1987-03-05 Nec Kyushu Ltd Coating device
JPS648621A (en) * 1987-06-30 1989-01-12 Fujitsu Ltd Resist coating apparatus
JPH01205422A (en) * 1988-02-10 1989-08-17 Tokyo Electron Ltd Resist coater
JPH0760786B2 (en) * 1988-02-10 1995-06-28 東京エレクトロン株式会社 Resist coating device
JPH01227437A (en) * 1988-03-07 1989-09-11 Tokyo Electron Ltd Developing device
JPH0158934U (en) * 1988-09-08 1989-04-13

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