JPS5621361A - Manufacture of dynamic memory cell - Google Patents
Manufacture of dynamic memory cellInfo
- Publication number
- JPS5621361A JPS5621361A JP9765479A JP9765479A JPS5621361A JP S5621361 A JPS5621361 A JP S5621361A JP 9765479 A JP9765479 A JP 9765479A JP 9765479 A JP9765479 A JP 9765479A JP S5621361 A JPS5621361 A JP S5621361A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- capacity
- substrate
- poly
- memory cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Drying Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To prevent the deterioration of transistor characteristics such as a threshold by preventing the formation of a barrier by a capacity P-N junction at the transistor gate region section of the memory cell of 1 transistor 1 capacity. CONSTITUTION:A field oxide film and an oxide thin film 7 for capacity are provided on a P-type Si substrate 5. A B additive poly Si 8 is stacked on the films and high temperature treatment is done in O2 to cover them with an SiO2 film 9. An N<+> layer 11 is made by applying resist masks 10 and by ion implantation. Next, the temperature of the substrate 5 is held at about 200 deg.C and the substrate 5 is exposed to an HF of several Torr. And selective etching removal is applied to the SiO2 9 only under the resist masks. The masks 10 are removed and photo etching is applied to the poly Si by consisting the SiO2 film 9 as a mask. The etching removal is applied to the side face B of the poly Si layer 8 for capacity electrode up to the position slightly behind the edge of the N<+> layer 11. Next, high temperature treatment is applied in H2 and the B is diffused from the poly Si 8 to make a P<+> layer 12 on the substrate 5. In this composition, the area of capacity electrode is smaller than the N<+> layer 11. Therefore, for the gate 13 of a MOSFET, the P<+> layer 12 will be formed without passing over the N<+> layer 11. So a barrier will not be formed and the characteristics of a memory cell will be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9765479A JPS5621361A (en) | 1979-07-31 | 1979-07-31 | Manufacture of dynamic memory cell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9765479A JPS5621361A (en) | 1979-07-31 | 1979-07-31 | Manufacture of dynamic memory cell |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5621361A true JPS5621361A (en) | 1981-02-27 |
JPS6138867B2 JPS6138867B2 (en) | 1986-09-01 |
Family
ID=14198061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9765479A Granted JPS5621361A (en) | 1979-07-31 | 1979-07-31 | Manufacture of dynamic memory cell |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5621361A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843569A (en) * | 1981-09-09 | 1983-03-14 | Nec Corp | Manufacture of semiconductor device |
JPH01194346A (en) * | 1988-01-28 | 1989-08-04 | Toshiba Corp | Semiconductor memory device |
JPH08317720A (en) * | 1996-06-17 | 1996-12-03 | Kubota Corp | Combine harvester |
-
1979
- 1979-07-31 JP JP9765479A patent/JPS5621361A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843569A (en) * | 1981-09-09 | 1983-03-14 | Nec Corp | Manufacture of semiconductor device |
JPH01194346A (en) * | 1988-01-28 | 1989-08-04 | Toshiba Corp | Semiconductor memory device |
JPH08317720A (en) * | 1996-06-17 | 1996-12-03 | Kubota Corp | Combine harvester |
JP2601647B2 (en) * | 1996-06-17 | 1997-04-16 | 株式会社クボタ | Combine |
Also Published As
Publication number | Publication date |
---|---|
JPS6138867B2 (en) | 1986-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5635459A (en) | Semiconductor memory device and manufacture thereof | |
JPS5696854A (en) | Semiconductor memory device | |
JPS5621361A (en) | Manufacture of dynamic memory cell | |
JPS5649554A (en) | Manufacture of semiconductor memory | |
JPS5687359A (en) | Manufacture of one transistor type memory cell | |
JPS59224141A (en) | Manufacture of semiconductor device | |
JPS57194583A (en) | Mos semiconductor device and manufacture thereof | |
JPS5538019A (en) | Manufacturing of semiconductor device | |
JPS57149774A (en) | Semiconductor device | |
JPS54114984A (en) | Semiconductor device | |
JPS56150860A (en) | Manufacture of semiconductor memory device | |
JPS54161889A (en) | Insulated gate type field effect transistor | |
JPS57177566A (en) | Schottky barrier gate type field effect transistor | |
JPS57107066A (en) | Complementary semiconductor device and manufacture thereof | |
JPS56108268A (en) | Manufacture of non volatile semiconductor memory device | |
JPH0265275A (en) | Manufacture of non-volatile semiconductor memory device | |
JPS5649553A (en) | Manufacture of semiconductor memory | |
JPS57107068A (en) | Complementary mis semiconductor device | |
JPS52146568A (en) | Production of silicon gate mos type semiconductor integrated circuit device | |
JPS56147447A (en) | Manufacture of mosic | |
JPS5586161A (en) | Manufacture of semiconductor device | |
JPS56108269A (en) | Semiconductor non volatile memory device | |
JPS57128921A (en) | Manufacture of semiconductor element | |
JPS5797674A (en) | Manufacture of mos semiconductor device | |
JPS57153472A (en) | Manufacture of semiconductor device |