JPS5620023A - Curable composition - Google Patents

Curable composition

Info

Publication number
JPS5620023A
JPS5620023A JP9580079A JP9580079A JPS5620023A JP S5620023 A JPS5620023 A JP S5620023A JP 9580079 A JP9580079 A JP 9580079A JP 9580079 A JP9580079 A JP 9580079A JP S5620023 A JPS5620023 A JP S5620023A
Authority
JP
Japan
Prior art keywords
varnish
diamine
component
specific
bismaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9580079A
Other languages
Japanese (ja)
Inventor
Akio Takahashi
Yutaka Ito
Yoichi Matsuda
Motoyo Wajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP9580079A priority Critical patent/JPS5620023A/en
Publication of JPS5620023A publication Critical patent/JPS5620023A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To make it possible to obtain cured products having excellent flame retardancy, moldability and a low water absorption, by setting a molar ratio of bismaleimide to diamine in a specific range, in producing a curable composition comprising a specific bismaleimide, a specific diamine and a silicone-modified resin.
CONSTITUTION: In methylcellosolve are dissolved a bisimide (component A), such as N,N'-ethylenebisimide, represented by formula I, wherein R1 is a bivalent organic group containing a C=C bond and R2 is an organic group containing at least 2C and a diamine component (component B), such as 4,4'-diaminodiphenylmethane. The ratio, A/B, is set in the range 1:0.2W1:1. The resulting mixture is reacted under heat, and then mixed with an epoxysilicone resin in an amount corresponding to 20W60wt% of the total weight of varnish. The mixture is reacted under heat, then cooled and mixed with dicyandiamide to produce a varnish. The varnish has utility in the production of moldings and laminating materials using glass cloth. These products have excellent flame retardancy and heat resistance.
COPYRIGHT: (C)1981,JPO&Japio
JP9580079A 1979-07-26 1979-07-26 Curable composition Pending JPS5620023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9580079A JPS5620023A (en) 1979-07-26 1979-07-26 Curable composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9580079A JPS5620023A (en) 1979-07-26 1979-07-26 Curable composition

Publications (1)

Publication Number Publication Date
JPS5620023A true JPS5620023A (en) 1981-02-25

Family

ID=14147504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9580079A Pending JPS5620023A (en) 1979-07-26 1979-07-26 Curable composition

Country Status (1)

Country Link
JP (1) JPS5620023A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214214A (en) * 1988-07-01 1990-01-18 Sumitomo Bakelite Co Ltd Resin composition for sealing
JPH02117958A (en) * 1988-07-05 1990-05-02 Shin Etsu Chem Co Ltd Polyamide resin composition and semiconductor device using same
JPH08113644A (en) * 1994-10-07 1996-05-07 Ppg Ind Inc Silylated polyamine polymer and chemically processed composition using same
CN108841029A (en) * 2018-06-08 2018-11-20 凯鑫管道科技有限公司 A kind of anticorrosive heatproof modification plastic and its preparation process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214214A (en) * 1988-07-01 1990-01-18 Sumitomo Bakelite Co Ltd Resin composition for sealing
JPH02117958A (en) * 1988-07-05 1990-05-02 Shin Etsu Chem Co Ltd Polyamide resin composition and semiconductor device using same
JPH08113644A (en) * 1994-10-07 1996-05-07 Ppg Ind Inc Silylated polyamine polymer and chemically processed composition using same
CN108841029A (en) * 2018-06-08 2018-11-20 凯鑫管道科技有限公司 A kind of anticorrosive heatproof modification plastic and its preparation process
CN108841029B (en) * 2018-06-08 2021-01-19 凯鑫管道科技有限公司 Corrosion-resistant heat-resistant modified plastic and preparation process thereof

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