JPS56167337A - Manufacture of resin-sealed type module - Google Patents
Manufacture of resin-sealed type moduleInfo
- Publication number
- JPS56167337A JPS56167337A JP6994280A JP6994280A JPS56167337A JP S56167337 A JPS56167337 A JP S56167337A JP 6994280 A JP6994280 A JP 6994280A JP 6994280 A JP6994280 A JP 6994280A JP S56167337 A JPS56167337 A JP S56167337A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- case
- pouring gate
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 4
- 239000004576 sand Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000006260 foam Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 238000007528 sand casting Methods 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent formation of foams and improve reliability, by providing a resin-pouring gate on the bottom or the side bottom of a case housing an electronic- circuit-loaded substrate, filling it with sand silica, etc. and sealing it by pouring resin. CONSTITUTION:In a resin-sealing process by sand casting, a resin-pouring gate 11 is provided on the bottom or the side bottom of a case 1 housing a circuit substrate 2. The substrate 2 is placed in the case 1 and the case is filled with a filler 3, such as sand silica, etc., in such a manner as to cover the substrate entirely, and then, such a material as epoxy resin 4 is poured into the pouring gate 11 by raising position of a resin container 12. After the resin 4 was poured, the pouring gate 11 is provided with a cover 14, and it is sealed by solidification of the resin 4. As the air trapped on the bottom of the substrate 2 becomes able to be released by doing so, it is possible to improve reliability of the module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6994280A JPS56167337A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6994280A JPS56167337A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56167337A true JPS56167337A (en) | 1981-12-23 |
Family
ID=13417211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6994280A Pending JPS56167337A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56167337A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232636A (en) * | 1989-03-06 | 1990-09-14 | Minolta Camera Co Ltd | Camera capable of recording photographing information |
KR19980703658A (en) * | 1995-04-12 | 1998-12-05 | 드로즈프랑소와 | Compact Transponder and Manufacturing Method Thereof |
JP2011211107A (en) * | 2010-03-30 | 2011-10-20 | Toshiba Corp | Method of resin-sealing mounting substrate |
JP2012223063A (en) * | 2011-04-14 | 2012-11-12 | Nikkiso Co Ltd | Canned motor pump and method for filling stator chamber of the canned motor pump with filler |
JP2014082233A (en) * | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | Semiconductor device and method of manufacturing the same |
-
1980
- 1980-05-26 JP JP6994280A patent/JPS56167337A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232636A (en) * | 1989-03-06 | 1990-09-14 | Minolta Camera Co Ltd | Camera capable of recording photographing information |
KR19980703658A (en) * | 1995-04-12 | 1998-12-05 | 드로즈프랑소와 | Compact Transponder and Manufacturing Method Thereof |
JP2011211107A (en) * | 2010-03-30 | 2011-10-20 | Toshiba Corp | Method of resin-sealing mounting substrate |
JP2012223063A (en) * | 2011-04-14 | 2012-11-12 | Nikkiso Co Ltd | Canned motor pump and method for filling stator chamber of the canned motor pump with filler |
US8729756B2 (en) | 2011-04-14 | 2014-05-20 | Nikkiso Co., Ltd. | Canned motor pump and method for filling filling member into stator chamber thereof |
JP2014082233A (en) * | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | Semiconductor device and method of manufacturing the same |
CN104685616A (en) * | 2012-10-12 | 2015-06-03 | 住友电气工业株式会社 | Semiconductor device and method for manufacturing same |
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