JPS56167337A - Manufacture of resin-sealed type module - Google Patents

Manufacture of resin-sealed type module

Info

Publication number
JPS56167337A
JPS56167337A JP6994280A JP6994280A JPS56167337A JP S56167337 A JPS56167337 A JP S56167337A JP 6994280 A JP6994280 A JP 6994280A JP 6994280 A JP6994280 A JP 6994280A JP S56167337 A JPS56167337 A JP S56167337A
Authority
JP
Japan
Prior art keywords
resin
substrate
case
pouring gate
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6994280A
Other languages
Japanese (ja)
Inventor
Takashi Sasaki
Kenzo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6994280A priority Critical patent/JPS56167337A/en
Publication of JPS56167337A publication Critical patent/JPS56167337A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent formation of foams and improve reliability, by providing a resin-pouring gate on the bottom or the side bottom of a case housing an electronic- circuit-loaded substrate, filling it with sand silica, etc. and sealing it by pouring resin. CONSTITUTION:In a resin-sealing process by sand casting, a resin-pouring gate 11 is provided on the bottom or the side bottom of a case 1 housing a circuit substrate 2. The substrate 2 is placed in the case 1 and the case is filled with a filler 3, such as sand silica, etc., in such a manner as to cover the substrate entirely, and then, such a material as epoxy resin 4 is poured into the pouring gate 11 by raising position of a resin container 12. After the resin 4 was poured, the pouring gate 11 is provided with a cover 14, and it is sealed by solidification of the resin 4. As the air trapped on the bottom of the substrate 2 becomes able to be released by doing so, it is possible to improve reliability of the module.
JP6994280A 1980-05-26 1980-05-26 Manufacture of resin-sealed type module Pending JPS56167337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6994280A JPS56167337A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6994280A JPS56167337A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Publications (1)

Publication Number Publication Date
JPS56167337A true JPS56167337A (en) 1981-12-23

Family

ID=13417211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6994280A Pending JPS56167337A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Country Status (1)

Country Link
JP (1) JPS56167337A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232636A (en) * 1989-03-06 1990-09-14 Minolta Camera Co Ltd Camera capable of recording photographing information
KR19980703658A (en) * 1995-04-12 1998-12-05 드로즈프랑소와 Compact Transponder and Manufacturing Method Thereof
JP2011211107A (en) * 2010-03-30 2011-10-20 Toshiba Corp Method of resin-sealing mounting substrate
JP2012223063A (en) * 2011-04-14 2012-11-12 Nikkiso Co Ltd Canned motor pump and method for filling stator chamber of the canned motor pump with filler
JP2014082233A (en) * 2012-10-12 2014-05-08 Sumitomo Electric Ind Ltd Semiconductor device and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232636A (en) * 1989-03-06 1990-09-14 Minolta Camera Co Ltd Camera capable of recording photographing information
KR19980703658A (en) * 1995-04-12 1998-12-05 드로즈프랑소와 Compact Transponder and Manufacturing Method Thereof
JP2011211107A (en) * 2010-03-30 2011-10-20 Toshiba Corp Method of resin-sealing mounting substrate
JP2012223063A (en) * 2011-04-14 2012-11-12 Nikkiso Co Ltd Canned motor pump and method for filling stator chamber of the canned motor pump with filler
US8729756B2 (en) 2011-04-14 2014-05-20 Nikkiso Co., Ltd. Canned motor pump and method for filling filling member into stator chamber thereof
JP2014082233A (en) * 2012-10-12 2014-05-08 Sumitomo Electric Ind Ltd Semiconductor device and method of manufacturing the same
CN104685616A (en) * 2012-10-12 2015-06-03 住友电气工业株式会社 Semiconductor device and method for manufacturing same

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