JPS56165590A - Cu-mn alloy brazing filler metal free from generation of pinhole defect - Google Patents

Cu-mn alloy brazing filler metal free from generation of pinhole defect

Info

Publication number
JPS56165590A
JPS56165590A JP6932880A JP6932880A JPS56165590A JP S56165590 A JPS56165590 A JP S56165590A JP 6932880 A JP6932880 A JP 6932880A JP 6932880 A JP6932880 A JP 6932880A JP S56165590 A JPS56165590 A JP S56165590A
Authority
JP
Japan
Prior art keywords
pinhole defect
filler metal
brazing filler
generation
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6932880A
Other languages
Japanese (ja)
Other versions
JPS6113912B2 (en
Inventor
Masaki Morikawa
Hideaki Yoshida
Kunio Kishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP6932880A priority Critical patent/JPS56165590A/en
Publication of JPS56165590A publication Critical patent/JPS56165590A/en
Publication of JPS6113912B2 publication Critical patent/JPS6113912B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Earth Drilling (AREA)

Abstract

PURPOSE:To prevent generation of pinhole defect and improve brazing shearing force and plastic workability by adding specified elements to a brazing filler metal of Cu-Mn alloy. CONSTITUTION:In brazing bits for grinding, rock-drilling, drilling etc. a Cu-Mn alloy having the following composition is used: 10-45% Mn, 1-25% Zn, 1-15% one or more of Fe, Ni, Co, 0.001-0.8% one or both of B, Li, the rest Cu. Or, 0.001-3% Al is added to increase oxidation resistance and strength of brazed part. This is excellent in plastic workability easily worked to fine wire and thin plate and seldom generates pinhole defect in the brazed part.
JP6932880A 1980-05-23 1980-05-23 Cu-mn alloy brazing filler metal free from generation of pinhole defect Granted JPS56165590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6932880A JPS56165590A (en) 1980-05-23 1980-05-23 Cu-mn alloy brazing filler metal free from generation of pinhole defect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6932880A JPS56165590A (en) 1980-05-23 1980-05-23 Cu-mn alloy brazing filler metal free from generation of pinhole defect

Publications (2)

Publication Number Publication Date
JPS56165590A true JPS56165590A (en) 1981-12-19
JPS6113912B2 JPS6113912B2 (en) 1986-04-16

Family

ID=13399365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6932880A Granted JPS56165590A (en) 1980-05-23 1980-05-23 Cu-mn alloy brazing filler metal free from generation of pinhole defect

Country Status (1)

Country Link
JP (1) JPS56165590A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0166144A2 (en) * 1984-06-22 1986-01-02 Allied Corporation Homogeneous low melting temperatures brazing filler metal for joining ferrous and non-ferrous alloys
DE102009032371A1 (en) * 2009-07-08 2011-01-13 Berkenhoff Gmbh Additional material for soldering steel sheets
CN104096988A (en) * 2013-04-07 2014-10-15 江西金世纪特种焊接材料有限公司 Rare earth La and Ce-containing low-Ag-Cu-P brazing filler metal
CN111015017A (en) * 2019-12-20 2020-04-17 西南交通大学 Mn-Cu-based welding wire and preparation method and application thereof
CN114592141A (en) * 2022-03-10 2022-06-07 中机智能装备创新研究院(宁波)有限公司 Impregnated alloy for drill bit matrix and preparation method and application thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0166144A2 (en) * 1984-06-22 1986-01-02 Allied Corporation Homogeneous low melting temperatures brazing filler metal for joining ferrous and non-ferrous alloys
EP0166144B1 (en) * 1984-06-22 1991-02-06 Allied Corporation Homogeneous low melting temperatures brazing filler metal for joining ferrous and non-ferrous alloys
DE102009032371A1 (en) * 2009-07-08 2011-01-13 Berkenhoff Gmbh Additional material for soldering steel sheets
JP2012532759A (en) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Sheet brazing aid
CN104096988A (en) * 2013-04-07 2014-10-15 江西金世纪特种焊接材料有限公司 Rare earth La and Ce-containing low-Ag-Cu-P brazing filler metal
CN111015017A (en) * 2019-12-20 2020-04-17 西南交通大学 Mn-Cu-based welding wire and preparation method and application thereof
CN111015017B (en) * 2019-12-20 2021-09-14 西南交通大学 Mn-Cu-based welding wire and preparation method and application thereof
CN114592141A (en) * 2022-03-10 2022-06-07 中机智能装备创新研究院(宁波)有限公司 Impregnated alloy for drill bit matrix and preparation method and application thereof

Also Published As

Publication number Publication date
JPS6113912B2 (en) 1986-04-16

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