JPS56148468A - Method and device for solder coating - Google Patents

Method and device for solder coating

Info

Publication number
JPS56148468A
JPS56148468A JP5276680A JP5276680A JPS56148468A JP S56148468 A JPS56148468 A JP S56148468A JP 5276680 A JP5276680 A JP 5276680A JP 5276680 A JP5276680 A JP 5276680A JP S56148468 A JPS56148468 A JP S56148468A
Authority
JP
Japan
Prior art keywords
solder
substrate
flux
downward
stuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5276680A
Other languages
Japanese (ja)
Inventor
Mikito Baba
Morikazu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP5276680A priority Critical patent/JPS56148468A/en
Publication of JPS56148468A publication Critical patent/JPS56148468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To obtain a solder stuck layer having uniform prescribed thickness with ease by sticking flux and solder to the layer to be stuck with solder, and blowing hot wind thereto from nozzles.
CONSTITUTION: A printed substrate 5 moved by a conveyor 2 stops in the position above a flux tank 6, then a unit 3 is driven to move a rod 4a downward, thereby moving the substrate 5 downward and immersing the same into flux 7. After a fixed time, the substrate 5 moves upward and resets in the state stuck with the flux 7, but on the way of this, it passes through the inside of a wiper so that the excess flux 7 is removed. Following to this, the substrate 5 is stopped in the position above a solder tank 8 by the intermittent movement of the conveyor 2, and again the rod 4a is moved downward by the driving of the unit 3, then the substrate 5 moves downward as well. During this time, it is preheated by the hot wind of nozzles 10 and is immersed in solder 9. After a fixed time, the substrate 5 is moved upward in the state stuck with the solder 9, thence hot wind of prescribed temperature and pressure is blown from a pair of nozzles 10, whereby the solders 9 on both surfaces are made uniform prescribed thickness.
COPYRIGHT: (C)1981,JPO&Japio
JP5276680A 1980-04-21 1980-04-21 Method and device for solder coating Pending JPS56148468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5276680A JPS56148468A (en) 1980-04-21 1980-04-21 Method and device for solder coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5276680A JPS56148468A (en) 1980-04-21 1980-04-21 Method and device for solder coating

Publications (1)

Publication Number Publication Date
JPS56148468A true JPS56148468A (en) 1981-11-17

Family

ID=12923989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5276680A Pending JPS56148468A (en) 1980-04-21 1980-04-21 Method and device for solder coating

Country Status (1)

Country Link
JP (1) JPS56148468A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045965A (en) * 1973-08-14 1975-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045965A (en) * 1973-08-14 1975-04-24

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