JPS56146228A - Method and device for heat-treatment of semiconductor substrate - Google Patents

Method and device for heat-treatment of semiconductor substrate

Info

Publication number
JPS56146228A
JPS56146228A JP5062180A JP5062180A JPS56146228A JP S56146228 A JPS56146228 A JP S56146228A JP 5062180 A JP5062180 A JP 5062180A JP 5062180 A JP5062180 A JP 5062180A JP S56146228 A JPS56146228 A JP S56146228A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
treatment
holder
opened
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5062180A
Other languages
Japanese (ja)
Inventor
Keiichi Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5062180A priority Critical patent/JPS56146228A/en
Publication of JPS56146228A publication Critical patent/JPS56146228A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To enable the uniform heat treatment continuously by a method wherein a holder on which the semiconductor substrate is mounted is inserted at one end of a core tube whose both ends are opened, and after the treatment being finished, the holder is carried out of the other end. CONSTITUTION:The core tube 10 is opened at the both ends, air curtains with inert gases being formed at the both ends, a gas conduit 11 being disposed in the tube, and quartz boats (the wafer holders) group 15 capable of being coupled with each other being coupled and moved by means of rubber belts 17, 18 which are driven by belt driving units 19, 20 turned at constant speed. Thereby, the continuous treatments are made possible, so that the productivity is improved, and each wafer is treated in the same manner, so that the fluctuation between the wafers is reduced.
JP5062180A 1980-04-16 1980-04-16 Method and device for heat-treatment of semiconductor substrate Pending JPS56146228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5062180A JPS56146228A (en) 1980-04-16 1980-04-16 Method and device for heat-treatment of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5062180A JPS56146228A (en) 1980-04-16 1980-04-16 Method and device for heat-treatment of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS56146228A true JPS56146228A (en) 1981-11-13

Family

ID=12864043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5062180A Pending JPS56146228A (en) 1980-04-16 1980-04-16 Method and device for heat-treatment of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS56146228A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833150A (en) * 1971-08-28 1973-05-08
JPS5243361A (en) * 1975-10-01 1977-04-05 Nippon Denso Co Ltd Thermal diffusion device for production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833150A (en) * 1971-08-28 1973-05-08
JPS5243361A (en) * 1975-10-01 1977-04-05 Nippon Denso Co Ltd Thermal diffusion device for production of semiconductor device

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