JPS56126945A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56126945A JPS56126945A JP3064880A JP3064880A JPS56126945A JP S56126945 A JPS56126945 A JP S56126945A JP 3064880 A JP3064880 A JP 3064880A JP 3064880 A JP3064880 A JP 3064880A JP S56126945 A JPS56126945 A JP S56126945A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- electrode
- rays
- alpha
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent malfunctioning of a highly integrated IC by shielding or damping alpha rays only with a polyimide resin applied on a ceramic substrate. CONSTITUTION:An electrode withdrawing port 2 of a semiconductor element 1 formed on a ceramic substrate 3 is connected direct to a metalized electrode 4 on the ceramic substrate 3 as an Au-based or Pb-based compound. A polyimide resin 8 is applied in a closed region 7 connecting an adjacent electrode 4 beforehand. If so, the release of alpha-rays from the ceramic substrate 3 can be shielded or damped with the resin thereby preventing malfunctioning of the element 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3064880A JPS56126945A (en) | 1980-03-10 | 1980-03-10 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3064880A JPS56126945A (en) | 1980-03-10 | 1980-03-10 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56126945A true JPS56126945A (en) | 1981-10-05 |
Family
ID=12309623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3064880A Pending JPS56126945A (en) | 1980-03-10 | 1980-03-10 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56126945A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826297A (en) * | 1985-12-25 | 1989-05-02 | Hitachi, Ltd. | Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing |
-
1980
- 1980-03-10 JP JP3064880A patent/JPS56126945A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826297A (en) * | 1985-12-25 | 1989-05-02 | Hitachi, Ltd. | Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing |
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