JPS56126945A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56126945A
JPS56126945A JP3064880A JP3064880A JPS56126945A JP S56126945 A JPS56126945 A JP S56126945A JP 3064880 A JP3064880 A JP 3064880A JP 3064880 A JP3064880 A JP 3064880A JP S56126945 A JPS56126945 A JP S56126945A
Authority
JP
Japan
Prior art keywords
ceramic substrate
electrode
rays
alpha
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3064880A
Other languages
Japanese (ja)
Inventor
Shuichi Osaka
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3064880A priority Critical patent/JPS56126945A/en
Publication of JPS56126945A publication Critical patent/JPS56126945A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent malfunctioning of a highly integrated IC by shielding or damping alpha rays only with a polyimide resin applied on a ceramic substrate. CONSTITUTION:An electrode withdrawing port 2 of a semiconductor element 1 formed on a ceramic substrate 3 is connected direct to a metalized electrode 4 on the ceramic substrate 3 as an Au-based or Pb-based compound. A polyimide resin 8 is applied in a closed region 7 connecting an adjacent electrode 4 beforehand. If so, the release of alpha-rays from the ceramic substrate 3 can be shielded or damped with the resin thereby preventing malfunctioning of the element 1.
JP3064880A 1980-03-10 1980-03-10 Semiconductor device Pending JPS56126945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3064880A JPS56126945A (en) 1980-03-10 1980-03-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3064880A JPS56126945A (en) 1980-03-10 1980-03-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56126945A true JPS56126945A (en) 1981-10-05

Family

ID=12309623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3064880A Pending JPS56126945A (en) 1980-03-10 1980-03-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56126945A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826297A (en) * 1985-12-25 1989-05-02 Hitachi, Ltd. Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826297A (en) * 1985-12-25 1989-05-02 Hitachi, Ltd. Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing

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