JPS56123396A - Plating bath of nickel-tungsten alloy - Google Patents
Plating bath of nickel-tungsten alloyInfo
- Publication number
- JPS56123396A JPS56123396A JP2579780A JP2579780A JPS56123396A JP S56123396 A JPS56123396 A JP S56123396A JP 2579780 A JP2579780 A JP 2579780A JP 2579780 A JP2579780 A JP 2579780A JP S56123396 A JPS56123396 A JP S56123396A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- plating bath
- nickel
- complexing agent
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve the throwing-power capability of an Ni-W alloy plating layer by adding a specific phenolic compound to an Ni-W alloy electroplating bath contg. Ni salt, W acid salt and complexing agent.
CONSTITUTION: A phenolic compound such as phenol, cresol, or salicylic acid expressed by the constitutional formula [I] is added at 3.5×10-4W3.5×10-3mol/l to an Ni-W alloy plating bath contg. 2.5W10g/l, in terms of Ni ion concn., Ni salt such as nickel sulfate, nickel acetate or the like, 0.2W0.9mol/l a complexing agent such as ammonium citrate, ammonium tartrate or the like and 0.1W0.5mol/l W acid salt such as Na salt or K salt of W acids as the composition for the plating bath used in electroplating of Ni-W alloys. Here, R1, R2, R3, R4, R5 in the formula [II] are H, alkyl group, halogen, COOH or SO3H, respectively.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2579780A JPS609598B2 (en) | 1980-02-29 | 1980-02-29 | Nickel-tungsten alloy plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2579780A JPS609598B2 (en) | 1980-02-29 | 1980-02-29 | Nickel-tungsten alloy plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56123396A true JPS56123396A (en) | 1981-09-28 |
JPS609598B2 JPS609598B2 (en) | 1985-03-11 |
Family
ID=12175829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2579780A Expired JPS609598B2 (en) | 1980-02-29 | 1980-02-29 | Nickel-tungsten alloy plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS609598B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853556A (en) * | 1996-03-14 | 1998-12-29 | Enthone-Omi, Inc. | Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys |
-
1980
- 1980-02-29 JP JP2579780A patent/JPS609598B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853556A (en) * | 1996-03-14 | 1998-12-29 | Enthone-Omi, Inc. | Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys |
Also Published As
Publication number | Publication date |
---|---|
JPS609598B2 (en) | 1985-03-11 |
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