JPS56123396A - Plating bath of nickel-tungsten alloy - Google Patents

Plating bath of nickel-tungsten alloy

Info

Publication number
JPS56123396A
JPS56123396A JP2579780A JP2579780A JPS56123396A JP S56123396 A JPS56123396 A JP S56123396A JP 2579780 A JP2579780 A JP 2579780A JP 2579780 A JP2579780 A JP 2579780A JP S56123396 A JPS56123396 A JP S56123396A
Authority
JP
Japan
Prior art keywords
salt
plating bath
nickel
complexing agent
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2579780A
Other languages
Japanese (ja)
Other versions
JPS609598B2 (en
Inventor
Shimetomo Fueki
Masao Tsuchiya
Motoo Yusa
Shigeo Ouchi
Keiji Kurata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2579780A priority Critical patent/JPS609598B2/en
Publication of JPS56123396A publication Critical patent/JPS56123396A/en
Publication of JPS609598B2 publication Critical patent/JPS609598B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To improve the throwing-power capability of an Ni-W alloy plating layer by adding a specific phenolic compound to an Ni-W alloy electroplating bath contg. Ni salt, W acid salt and complexing agent.
CONSTITUTION: A phenolic compound such as phenol, cresol, or salicylic acid expressed by the constitutional formula [I] is added at 3.5×10-4W3.5×10-3mol/l to an Ni-W alloy plating bath contg. 2.5W10g/l, in terms of Ni ion concn., Ni salt such as nickel sulfate, nickel acetate or the like, 0.2W0.9mol/l a complexing agent such as ammonium citrate, ammonium tartrate or the like and 0.1W0.5mol/l W acid salt such as Na salt or K salt of W acids as the composition for the plating bath used in electroplating of Ni-W alloys. Here, R1, R2, R3, R4, R5 in the formula [II] are H, alkyl group, halogen, COOH or SO3H, respectively.
COPYRIGHT: (C)1981,JPO&Japio
JP2579780A 1980-02-29 1980-02-29 Nickel-tungsten alloy plating bath Expired JPS609598B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2579780A JPS609598B2 (en) 1980-02-29 1980-02-29 Nickel-tungsten alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2579780A JPS609598B2 (en) 1980-02-29 1980-02-29 Nickel-tungsten alloy plating bath

Publications (2)

Publication Number Publication Date
JPS56123396A true JPS56123396A (en) 1981-09-28
JPS609598B2 JPS609598B2 (en) 1985-03-11

Family

ID=12175829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2579780A Expired JPS609598B2 (en) 1980-02-29 1980-02-29 Nickel-tungsten alloy plating bath

Country Status (1)

Country Link
JP (1) JPS609598B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853556A (en) * 1996-03-14 1998-12-29 Enthone-Omi, Inc. Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853556A (en) * 1996-03-14 1998-12-29 Enthone-Omi, Inc. Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys

Also Published As

Publication number Publication date
JPS609598B2 (en) 1985-03-11

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