JPS56111653A - Reactive extrusion mold - Google Patents
Reactive extrusion moldInfo
- Publication number
- JPS56111653A JPS56111653A JP1369280A JP1369280A JPS56111653A JP S56111653 A JPS56111653 A JP S56111653A JP 1369280 A JP1369280 A JP 1369280A JP 1369280 A JP1369280 A JP 1369280A JP S56111653 A JPS56111653 A JP S56111653A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- compressed air
- air blast
- blown
- vent hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To remarkably improve an operational efficiency by a method wherein an opening part for a compressed air blast is installed at a cavity part of the inside of upper and lower molds and a residual burr in the mold is blown off with the compressed air. CONSTITUTION:A vent hole 16 for a compressed air blast is opened within a cavity 11 formed with a combination of upper and lower molds. And an extrusion molding material raw liquid is injected into the cavity 11 and a molding is performed with a chemical reaction and thereafter, a molding product is taken out. Next thereto, the compressed air from a compressor 19 is blown into the cavity 11 through an air hose 18, an air blast port 17 and the vent hole 16. By means of this compressed air, the residual burr attached to the inside of the cavity 11 is easily and rapidly eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1369280A JPS56111653A (en) | 1980-02-08 | 1980-02-08 | Reactive extrusion mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1369280A JPS56111653A (en) | 1980-02-08 | 1980-02-08 | Reactive extrusion mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56111653A true JPS56111653A (en) | 1981-09-03 |
Family
ID=11840235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1369280A Pending JPS56111653A (en) | 1980-02-08 | 1980-02-08 | Reactive extrusion mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56111653A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103624898A (en) * | 2012-07-20 | 2014-03-12 | 名硕电脑(苏州)有限公司 | Mold having chip removal function |
-
1980
- 1980-02-08 JP JP1369280A patent/JPS56111653A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103624898A (en) * | 2012-07-20 | 2014-03-12 | 名硕电脑(苏州)有限公司 | Mold having chip removal function |
CN103624898B (en) * | 2012-07-20 | 2016-05-04 | 名硕电脑(苏州)有限公司 | There is the mould of chip removal function |
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