JPS56105642A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56105642A
JPS56105642A JP818680A JP818680A JPS56105642A JP S56105642 A JPS56105642 A JP S56105642A JP 818680 A JP818680 A JP 818680A JP 818680 A JP818680 A JP 818680A JP S56105642 A JPS56105642 A JP S56105642A
Authority
JP
Japan
Prior art keywords
electrode
sleeve
jig
center
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP818680A
Other languages
Japanese (ja)
Inventor
Osamu Tadano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP818680A priority Critical patent/JPS56105642A/en
Publication of JPS56105642A publication Critical patent/JPS56105642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the destruction of sleeve or the deterioration of electric characteristic of the semiconductor device by a method wherein after a semiconductor pellet is preliminarily atached temporarily to the center of an electrode, they are sealed in a glass sleeve. CONSTITUTION:The glass sleeve 2 and the electrode 1a are put in a lower part jig 5. The electrode 1a is lifted up to the upper end face of the sleeve 2 and an adhesive 4 is applied thinly. A jig 7 having a hole at the center of the electrode 1a is put on the jig 5, and the diode pellet 3 is adhered in the hole. The electrode 1a is made to descend, an electrode 1b and a jig 6 is set together, and the electrode and the sleeve are welded. By this constitution, because the pellet 3 locates at the center of the electrode and comes not in contact with the sleeve after the sealing, so that the concentration of stress is not generated, and the destruction of sleeve and the deterioration of characteristic of the element are eliminated.
JP818680A 1980-01-25 1980-01-25 Manufacture of semiconductor device Pending JPS56105642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP818680A JPS56105642A (en) 1980-01-25 1980-01-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP818680A JPS56105642A (en) 1980-01-25 1980-01-25 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56105642A true JPS56105642A (en) 1981-08-22

Family

ID=11686265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP818680A Pending JPS56105642A (en) 1980-01-25 1980-01-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56105642A (en)

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