JPS645079A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS645079A
JPS645079A JP16060787A JP16060787A JPS645079A JP S645079 A JPS645079 A JP S645079A JP 16060787 A JP16060787 A JP 16060787A JP 16060787 A JP16060787 A JP 16060787A JP S645079 A JPS645079 A JP S645079A
Authority
JP
Japan
Prior art keywords
light emitting
low stress
resin
electrode
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16060787A
Other languages
Japanese (ja)
Inventor
Yoshinari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16060787A priority Critical patent/JPS645079A/en
Publication of JPS645079A publication Critical patent/JPS645079A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To eliminate the necessity of applying low stress resin between a light emitting element and packaging epoxy resin and improve a reliability by employing the light emitting element whose surface except a surface electrode is covered with a low stress material layer. CONSTITUTION:The surface part of a light emitting element 1 except an electrode 13 on the surface and including the exposed end part of the p-n junction 12 is covered with a low stress material layer such as a polyimide resin layer 14. The electrode 13 of the element 1 is connected to the tip of a lead 3 with a bonding wire 4. The element 1, the bonding wire 4 and the tip part of the lead 3 are sealed together with epoxy resin 6. With this constitution, the necessity of applying low stress resin between the element and the packaging epoxy resin 6 can be eliminated so that a reliability can be improved.
JP16060787A 1987-06-26 1987-06-26 Semiconductor light emitting device Pending JPS645079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16060787A JPS645079A (en) 1987-06-26 1987-06-26 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16060787A JPS645079A (en) 1987-06-26 1987-06-26 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS645079A true JPS645079A (en) 1989-01-10

Family

ID=15718599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16060787A Pending JPS645079A (en) 1987-06-26 1987-06-26 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS645079A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017120840A (en) * 2015-12-28 2017-07-06 シャープ株式会社 Light emitting element, light emitting element package body, and method of manufacturing light emitting element
JP2017135214A (en) * 2016-01-26 2017-08-03 株式会社東芝 Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017120840A (en) * 2015-12-28 2017-07-06 シャープ株式会社 Light emitting element, light emitting element package body, and method of manufacturing light emitting element
JP2017135214A (en) * 2016-01-26 2017-08-03 株式会社東芝 Semiconductor device

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