JPS56103484A - Manufacture of semiconductor device for photoelectric conversion - Google Patents

Manufacture of semiconductor device for photoelectric conversion

Info

Publication number
JPS56103484A
JPS56103484A JP545280A JP545280A JPS56103484A JP S56103484 A JPS56103484 A JP S56103484A JP 545280 A JP545280 A JP 545280A JP 545280 A JP545280 A JP 545280A JP S56103484 A JPS56103484 A JP S56103484A
Authority
JP
Japan
Prior art keywords
conversion units
lens
metal mold
materials
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP545280A
Other languages
Japanese (ja)
Inventor
Takeo Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP545280A priority Critical patent/JPS56103484A/en
Publication of JPS56103484A publication Critical patent/JPS56103484A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To exactly position a lens and to reduce a cost for the manufacture by a method wherein a plurality of the photoelectric conversion units are formed on a semiconductor wafer at fixed intervals, and the lens means are formed on the conversion units by pressing to the wafer the metal mold in which lens materials are burried corresponded to those conversion units. CONSTITUTION:The plural photoelectric conversion units 2 are formed at fixed intervals on a silicon wafer with the surfaces of the units made smooth, and the metal mold 3 is arranged on the side of the formation of the units 2. With this construction, the metal mold 3 is formed with lens receiving parts 4 corresponding to the conversion units 2, and lens materials 5 of molten glass or transparent resin or the like is filled in the receiving parts 4, with the surface heaped up. Then, the conversion units 2 and the materials 5 are contacted with each other by piling the wafer 1 and the metal mold 3 together using a concave 6 formed on the periphery of the metal mold 3 and cooled to solidify the materials 5 and to make the lens means 7 to be produced on the conversion units 2. Thereafter, the conversion units 2 are separated into an individual one, and the lens means 7 on the peripheries are surrounded by opaque resins.
JP545280A 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion Pending JPS56103484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP545280A JPS56103484A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP545280A JPS56103484A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Publications (1)

Publication Number Publication Date
JPS56103484A true JPS56103484A (en) 1981-08-18

Family

ID=11611596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP545280A Pending JPS56103484A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Country Status (1)

Country Link
JP (1) JPS56103484A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021179A (en) * 1988-02-09 1990-01-05 Canon Inc Manufacture of photoelectric conversion device
JPH0357949U (en) * 1989-10-09 1991-06-05
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
USRE35069E (en) * 1990-12-12 1995-10-24 Eastman Kodak Company Optoelectronic device component package
WO2000041221A3 (en) * 1999-01-04 2000-11-02 Infineon Technologies Ag Method and device for shaping surfaces of semiconductors
CN102136523A (en) * 2010-12-22 2011-07-27 木林森股份有限公司 Encapsulation method for eyeball infrared receiver, special die and manufactured product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021179A (en) * 1988-02-09 1990-01-05 Canon Inc Manufacture of photoelectric conversion device
JPH0357949U (en) * 1989-10-09 1991-06-05
USRE35069E (en) * 1990-12-12 1995-10-24 Eastman Kodak Company Optoelectronic device component package
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
WO2000041221A3 (en) * 1999-01-04 2000-11-02 Infineon Technologies Ag Method and device for shaping surfaces of semiconductors
US6716659B2 (en) 1999-01-04 2004-04-06 Infineon Technologies Ag Method and apparatus for shaping semiconductor surfaces
CN102136523A (en) * 2010-12-22 2011-07-27 木林森股份有限公司 Encapsulation method for eyeball infrared receiver, special die and manufactured product

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