JPS56102102A - Stereo-plane circuit - Google Patents
Stereo-plane circuitInfo
- Publication number
- JPS56102102A JPS56102102A JP518180A JP518180A JPS56102102A JP S56102102 A JPS56102102 A JP S56102102A JP 518180 A JP518180 A JP 518180A JP 518180 A JP518180 A JP 518180A JP S56102102 A JPS56102102 A JP S56102102A
- Authority
- JP
- Japan
- Prior art keywords
- extended part
- diode
- extended
- frame
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
- H03D9/00—Demodulation or transference of modulation of modulated electromagnetic waves
- H03D9/06—Transference of modulation using distributed inductance and capacitance
- H03D9/0608—Transference of modulation using distributed inductance and capacitance by means of diodes
- H03D9/0633—Transference of modulation using distributed inductance and capacitance by means of diodes mounted on a stripline circuit
- H03D9/0641—Transference of modulation using distributed inductance and capacitance by means of diodes mounted on a stripline circuit located in a hollow waveguide
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Waveguide Connection Structure (AREA)
Abstract
PURPOSE:To make it possible to minimize the parasitic capacity and inductance component, by fitting a beam lead type mixer diode to the end of a metallic film extended on an extended part of a dielectric plate, and by installing an insulating case around the diode at the extended part. CONSTITUTION:F-shaped metallic film 14 fitted on dielectric plate 12 has end part 15 which is extended to extended part 15, and one terminal of beam lead type mixed diode 16 is soldered to extended part 15. The other terminal of diode 16 is soldered on conductive layer 17 installed on extended part 13 of plate 12, and layer 17 is connected strip 3 by overlapping. Therefore, diode 16 mounted on extended part 13 is surrounded by frame-shaped insulating case 18 on extended part 13. A simple frame-shaped frame is sufficient for this case 18. In this way, the parasitic capacity caused by the package and the inductance component caused by the bonding wire can be minimized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518180A JPS56102102A (en) | 1980-01-18 | 1980-01-18 | Stereo-plane circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518180A JPS56102102A (en) | 1980-01-18 | 1980-01-18 | Stereo-plane circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56102102A true JPS56102102A (en) | 1981-08-15 |
JPS6239563B2 JPS6239563B2 (en) | 1987-08-24 |
Family
ID=11604055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP518180A Granted JPS56102102A (en) | 1980-01-18 | 1980-01-18 | Stereo-plane circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56102102A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03105368U (en) * | 1990-02-14 | 1991-10-31 | ||
KR102039128B1 (en) * | 2016-11-21 | 2019-10-31 | 주식회사 엘지화학 | Modified agent, method for preparing the same and modified conjugated diene polymer comprising the same |
-
1980
- 1980-01-18 JP JP518180A patent/JPS56102102A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6239563B2 (en) | 1987-08-24 |
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