ES273365U - Electronic component assembly - Google Patents

Electronic component assembly

Info

Publication number
ES273365U
ES273365U ES1983273365U ES273365U ES273365U ES 273365 U ES273365 U ES 273365U ES 1983273365 U ES1983273365 U ES 1983273365U ES 273365 U ES273365 U ES 273365U ES 273365 U ES273365 U ES 273365U
Authority
ES
Spain
Prior art keywords
component
electric conductor
electric
conductor pattern
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1983273365U
Other languages
Spanish (es)
Other versions
ES273365Y (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from BE2/59767A external-priority patent/BE893780A/en
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES273365U publication Critical patent/ES273365U/en
Application granted granted Critical
Publication of ES273365Y publication Critical patent/ES273365Y/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An electronic component assembly includes a first component (1) which is leadless and has a plurality of electric conductor pads (4) and a second component (2) carrying an electric conductor pattern (6), the first component being mounted on the second component and the contact pads being electrically connected to the electric conductor pattern. An insulating intermediate element (3), provided to absorb stresses between the components, is mounted between the electric contact pads and the electric conductor pattern on the first and second components respectively. This intermediate element is constituted by a strip of insulating material carrying ductile electric conductors (9) having contact portions (10, 11) electrically interconnecting the electric contact pads and the electric conductor pattern.
ES1983273365U 1982-07-07 1983-07-07 AN ELECTRONIC COMPONENT ASSEMBLY Expired ES273365Y (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE2/59767A BE893780A (en) 1982-07-07 1982-07-07 Chip carrier with flexible spacer sheet isolating voltages - has contact legs forming continuity with printed wiring via sheet conductors

Publications (2)

Publication Number Publication Date
ES273365U true ES273365U (en) 1984-02-01
ES273365Y ES273365Y (en) 1984-09-01

Family

ID=3865605

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1983273365U Expired ES273365Y (en) 1982-07-07 1983-07-07 AN ELECTRONIC COMPONENT ASSEMBLY

Country Status (3)

Country Link
JP (1) JPS5922386A (en)
ES (1) ES273365Y (en)
GB (1) GB2124433B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196994A (en) * 1984-03-19 1985-10-05 日本電気株式会社 Connecting system for circuit
JPS63118262U (en) * 1987-01-23 1988-07-30
US4855872A (en) * 1987-08-13 1989-08-08 General Electric Company Leadless ceramic chip carrier printed wiring board adapter
US5023580A (en) * 1989-12-22 1991-06-11 Motorola, Inc. Surface-mount filter
JP2541046B2 (en) * 1991-09-20 1996-10-09 株式会社大真空 Surface mount electronic components
US5400219A (en) * 1992-09-02 1995-03-21 Eastman Kodak Company Tape automated bonding for electrically connecting semiconductor chips to substrates
JPH0750762B2 (en) * 1992-12-18 1995-05-31 山一電機株式会社 IC carrier
US5494448A (en) * 1994-03-15 1996-02-27 Motorola, Inc. Cantilever spring and method for temporarily coupling a semiconductor device to a transmission line using the cantilever spring
JPH0823160A (en) * 1994-05-06 1996-01-23 Seiko Epson Corp Method for bonding printed board with electronic component
DE19719235A1 (en) 1997-05-07 1998-11-12 Bosch Gmbh Robert Method for contacting at least one printed circuit board or at least one lead frame and at least one hybrid
TW405129B (en) * 1997-12-19 2000-09-11 Koninkl Philips Electronics Nv Thin-film component
DE10307846A1 (en) * 2003-02-25 2004-09-02 Daimlerchrysler Ag Method for electrically contacting a component with a flat cable

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614575A1 (en) * 1966-08-16 1970-05-27 Signetics Corp Integrated circuit structure and method of making that structure
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
NL164425C (en) * 1971-02-05 1980-12-15 Philips Nv SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
JPS52140271A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Device and manufacture for collection-type semiconductor
JPS54152468A (en) * 1978-05-22 1979-11-30 Hitachi Ltd Carrier tape for tape carrier

Also Published As

Publication number Publication date
JPS5922386A (en) 1984-02-04
GB2124433B (en) 1986-05-21
GB8318318D0 (en) 1983-08-10
GB2124433A (en) 1984-02-15
ES273365Y (en) 1984-09-01

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